Comment stsetch SNF 2010-03-22 11:36:06: Update backside He flow

eenriquez at eenriquez at
Mon Mar 22 11:36:06 PDT 2010

Backside He flow during process is at maximum.  Found the He bleed valve was misadjusted.  Adjusted the flow so that when the backside of the wafer is perfecly sealed, the flow is at ~2.4 sccm.  Now flow is OK when running a wafer without a carrier.
Now troubleshooting why the He flow jumps from 2.4 to 4.6 sccm, when running with a carrier, as soon as any gas starts to flow.

More information about the stsetch-pcs mailing list