From latta at snf.stanford.edu Tue May 4 13:02:22 2010 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 4 May 2010 13:02:22 -0700 Subject: Problem stsetch SNF 2010-04-02 17:05:25: Etch rates after chuck rebuild Message-ID: new qual posted From latta at snf.stanford.edu Tue May 4 13:04:24 2010 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 4 May 2010 13:04:24 -0700 Subject: Comment stsetch SNF 2010-05-04 13:04:23: May qual Message-ID: DEEP 00:10:00 Si ER =2.41um/mi PR ER = 238A/min Si : PR Sel = 101 : 1 From eenriquez at snf.stanford.edu Thu May 6 10:08:37 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 6 May 2010 10:08:37 -0700 Subject: Problem stsetch SNF 2010-05-06 10:08:36: High cooling He flow Message-ID: Replaced the lip seal but He flow still around 5 sccm. Need to troubleshoot further. From eenriquez at snf.stanford.edu Thu May 6 11:09:07 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 6 May 2010 11:09:07 -0700 Subject: Comment stsetch SNF 2010-05-06 11:09:06: Update Message-ID: anti condensation unit (chamber bottom N2 purge) checked out OK. From eenriquez at snf.stanford.edu Thu May 6 14:24:34 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 6 May 2010 14:24:34 -0700 Subject: Comment stsetch SNF 2010-05-06 11:09:06: Update Message-ID: wrong tool From mtan at snf.stanford.edu Fri May 7 21:20:38 2010 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Fri, 7 May 2010 21:20:38 -0700 Subject: Problem stsetch SNF 2010-05-07 21:20:38: broken piece outside the holding area Message-ID: The machine is functional, but there are 2 broken pieces left in the chamber by the previous user. From jjeong1 at snf.stanford.edu Sat May 8 16:46:42 2010 From: jjeong1 at snf.stanford.edu (jjeong1 at snf.stanford.edu) Date: Sat, 8 May 2010 16:46:42 -0700 Subject: Problem stsetch SNF 2010-05-08 16:46:42: flow fluctuation Message-ID: flow fluctuation varies from 3 to 7 during process. so, etch rate is not constant over a wafer. From pponce at snf.stanford.edu Sun May 9 19:27:44 2010 From: pponce at snf.stanford.edu (pponce at snf.stanford.edu) Date: Sun, 9 May 2010 19:27:44 -0700 Subject: Problem stsetch SNF 2010-05-09 19:27:44: He Pressure Message-ID: The He pressure gauge was not stable during my etch. I ranged from 6.4 to -0.9. I was using the wafer holder with the black O-ring. He flow was fine. From dton at snf.stanford.edu Sun May 9 19:31:01 2010 From: dton at snf.stanford.edu (dton at snf.stanford.edu) Date: Sun, 9 May 2010 19:31:01 -0700 Subject: Problem stsetch SNF 2010-05-09 19:31:01: He Pressure Message-ID: Same as pponce reported. I did not used wafer holder... Back pressured is about 4-6 Torr with flow at 5... From nharjee at snf.stanford.edu Mon May 10 16:24:02 2010 From: nharjee at snf.stanford.edu (nharjee at snf.stanford.edu) Date: Mon, 10 May 2010 16:24:02 -0700 Subject: Problem stsetch SNF 2010-05-10 16:24:02: More troubles with backside He Message-ID: The released devices from the E341 class process show significant widening of trenches as the etch progresses. Wafers were etched with the DEEP recipe using the holder. For the duration of the etch, He flow was pegged at the limit of 5 sccm. As a result, cooling was probably not effective, leading to poor sidewall passivation. This is a real problem. Do not clear it just because 1 wafer runs for 10 minutes with the correct flow. Right now, this tool is not usable for critical deep etches. From jjeong1 at snf.stanford.edu Mon May 10 22:16:27 2010 From: jjeong1 at snf.stanford.edu (jjeong1 at snf.stanford.edu) Date: Mon, 10 May 2010 22:16:27 -0700 Subject: Problem stsetch SNF 2010-05-10 22:16:27: He flow fluctuation Message-ID: SMOODEEP was run without problems for the first two 20 min etches. But from the third try, He flow started fluctuating a lot between 3 - 7, andthe etch rate was not uniform over a single wafer. From jjeong1 at snf.stanford.edu Tue May 11 21:17:16 2010 From: jjeong1 at snf.stanford.edu (jjeong1 at snf.stanford.edu) Date: Tue, 11 May 2010 21:17:16 -0700 Subject: Problem stsetch SNF 2010-05-11 21:17:15: Serial communication fault Message-ID: Due to the serial communication error, couldn't start the process and couldn't unload the wafer. The wafer is still in the chamber. From eenriquez at snf.stanford.edu Wed May 12 10:23:02 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 12 May 2010 10:23:02 -0700 Subject: Problem stsetch SNF 2010-05-11 21:17:15: Serial communication fault Message-ID: Reset the system and recovered the user's wafer. From eenriquez at snf.stanford.edu Wed May 12 10:23:33 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 12 May 2010 10:23:33 -0700 Subject: Shutdown stsetch SNF 2010-05-12 10:23:33: He cooling leak Message-ID: From eenriquez at snf.stanford.edu Wed May 12 10:32:50 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 12 May 2010 10:32:50 -0700 Subject: Shutdown stsetch SNF 2010-05-12 10:23:33: He cooling leak Message-ID: User wants to use the system even with the leak. From mtan at snf.stanford.edu Wed May 12 11:23:28 2010 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Wed, 12 May 2010 11:23:28 -0700 Subject: Shutdown stsetch SNF 2010-05-12 11:23:27: excessive load lock error Message-ID: From eenriquez at snf.stanford.edu Wed May 12 18:21:24 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 12 May 2010 18:21:24 -0700 Subject: Shutdown stsetch SNF 2010-05-12 11:23:27: excessive load lock error Message-ID: Reset the system. From xzhuan1 at snf.stanford.edu Thu May 13 19:54:40 2010 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Thu, 13 May 2010 19:54:40 -0700 Subject: Problem stsetch SNF 2010-05-13 19:54:39: cannot load wafer Message-ID: "lock not available alarm". lid is open in the control software no matter what. From xzhuan1 at snf.stanford.edu Thu May 13 20:24:36 2010 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Thu, 13 May 2010 20:24:36 -0700 Subject: Shutdown stsetch SNF 2010-05-13 20:24:35: load plate shaking Message-ID: The load plate shaked violently when I pressed the reset button. Tried to restart the computer, but the operator station got stuck trying to establish communication with the etcher. From eenriquez at snf.stanford.edu Fri May 14 09:50:47 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 14 May 2010 09:50:47 -0700 Subject: Shutdown stsetch SNF 2010-05-13 20:24:35: load plate shaking Message-ID: Loader and ICP controller were out of sync. Reset the whole system and ran a test with no problems. From bchui at snf.stanford.edu Fri May 14 16:07:22 2010 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Fri, 14 May 2010 16:07:22 -0700 Subject: Problem stsetch SNF 2010-05-14 16:07:21: Erroneous cover-open sensor Message-ID: The past few days, the machine would error out thinking that the load lock cover is open although it's actually closed. Disabling and re-enabling the machine helps get rid of the error. The sensor is probably getting old. From bchui at snf.stanford.edu Fri May 14 16:20:26 2010 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Fri, 14 May 2010 16:20:26 -0700 Subject: Comment stsetch SNF 2010-05-14 16:20:25: Re: load lock cover sensor erratic behavior Message-ID: I wonder if it's not the Coral interlock that's being intermittent... From xzhuan1 at snf.stanford.edu Fri May 14 19:08:04 2010 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Fri, 14 May 2010 19:08:04 -0700 Subject: Problem stsetch SNF 2010-05-14 19:08:03: controller error Message-ID: can not vent and unload wafer From ericp at snf.stanford.edu Sun May 16 00:27:57 2010 From: ericp at snf.stanford.edu (ericp at snf.stanford.edu) Date: Sun, 16 May 2010 00:27:57 -0700 Subject: Comment stsetch SNF 2010-05-16 00:27:57: controller error cleared, wafer recovered. Message-ID: was able to clear the controller error and recover steve's wafer. system seems ok to use, but I didn't thoroughly test it. From cbaxter at snf.stanford.edu Sun May 16 04:51:39 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 16 May 2010 04:51:39 -0700 Subject: Comment stsetch SNF 2010-05-16 00:27:57: controller error cleared, wafer recovered. Message-ID: From cbaxter at snf.stanford.edu Sun May 16 04:51:49 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 16 May 2010 04:51:49 -0700 Subject: Problem stsetch SNF 2010-05-14 19:08:03: controller error Message-ID: From cbaxter at snf.stanford.edu Sun May 16 22:46:32 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 16 May 2010 22:46:32 -0700 Subject: Problem stsetch SNF 2010-05-14 16:07:21: Erroneous cover-open sensor Message-ID: I secured the interlock wires on the coral box, if it failed again will changed the interlock box. From cbaxter at snf.stanford.edu Sun May 16 22:47:08 2010 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 16 May 2010 22:47:08 -0700 Subject: Problem stsetch SNF 2010-05-13 19:54:39: cannot load wafer Message-ID: From damodei at snf.stanford.edu Mon May 17 18:02:48 2010 From: damodei at snf.stanford.edu (damodei at snf.stanford.edu) Date: Mon, 17 May 2010 18:02:48 -0700 Subject: Problem stsetch SNF 2010-05-17 18:02:47: Helium pressure extremely low Message-ID: Getting a helium pressure of 1.0 Torr, leak rate is normal. Pressure setpoint is still 9.8, so clearly the machine is trying to increase the pressure, and not succeeding. From damodei at snf.stanford.edu Tue May 18 02:46:43 2010 From: damodei at snf.stanford.edu (damodei at snf.stanford.edu) Date: Tue, 18 May 2010 02:46:43 -0700 Subject: Problem stsetch SNF 2010-05-18 02:46:42: wafer broke in chamber Message-ID: Wafer was in holder, so most of the pieces were recovered, though some remain in the chamber. I've etched wafers like this before and non have broken; I wonder if the heating due to low helium pressure was an issue. In any case, the chamber needs to be cleaned and the helium problem addressed urgently. From eenriquez at snf.stanford.edu Tue May 18 14:59:08 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 18 May 2010 14:59:08 -0700 Subject: Problem stsetch SNF 2010-05-18 02:46:42: wafer broke in chamber Message-ID: Cleaned the chamber. Lip seal and clamp fingers checked oK. Still troubleshooting the high He problem. From ywidjaja at snf.stanford.edu Wed May 19 04:22:57 2010 From: ywidjaja at snf.stanford.edu (ywidjaja at snf.stanford.edu) Date: Wed, 19 May 2010 04:22:57 -0700 Subject: Comment stsetch SNF 2010-05-19 04:22:56: Coil power out of tolerance error Message-ID: Encountered the above error, but ok after restarting the process. From eenriquez at snf.stanford.edu Fri May 21 15:24:15 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 21 May 2010 15:24:15 -0700 Subject: Comment stsetch SNF 2010-05-21 15:24:14: Update He leak rate Message-ID: Unable to find the source of leak. Need further troubleshooting. From mislam at snf.stanford.edu Sun May 23 03:32:46 2010 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Sun, 23 May 2010 03:32:46 -0700 Subject: Problem stsetch SNF 2010-05-23 03:32:36: Broken wafer pieces Message-ID: Previous used left broken Si pieces in the chamber. He pressure is bad. Not safre to run. From rik at snf.stanford.edu Sun May 23 16:35:16 2010 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Sun, 23 May 2010 16:35:16 -0700 Subject: Comment stsetch SNF 2010-05-23 16:35:15: Etch observations Message-ID: He pressure was beteen 3.5-4.5, while setpoint was ~9. Flow was maxed at ~5.1. Ran etches with holder. Took 4.5 hours to clear 400um of silicon. Features were 60um x 240um rectangles. 10-20% exposed area. Etch rate seems to be extremely low [1.4-1.5um / min!] with holder. Resist held up without visible damage [7um SPR-220] From xzhuan1 at snf.stanford.edu Wed May 26 09:17:53 2010 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Wed, 26 May 2010 09:17:53 -0700 Subject: Problem stsetch SNF 2010-05-26 09:17:52: icp exception during etching Message-ID: I tried to etch my wafer for two hours. however, about 10 min into the etching, icp exception occured and the etching was stopped. This happened two time in a row. I discovered this problem by viewing machine log. From latta at snf.stanford.edu Thu May 27 14:56:01 2010 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 27 May 2010 14:56:01 -0700 Subject: Problem stsetch SNF 2010-05-23 03:32:36: Broken wafer pieces Message-ID: noted From latta at snf.stanford.edu Thu May 27 15:02:53 2010 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 27 May 2010 15:02:53 -0700 Subject: Comment stsetch SNF 2010-05-27 15:02:52: Late May Qual- ER low Message-ID: DEEP 00:10:00 Si ER =1.71um/min PR ER = 185A/min Si : PR Sel = 92 : 1 Etch rates have decreased significantly. Observed the already repoted He pressure oscillations from 2.4 to 3.0. He flow steady at 5.1 Also got error 'IPC not available' at the end of the etch, twice. From mtan at snf.stanford.edu Fri May 28 11:41:15 2010 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Fri, 28 May 2010 11:41:15 -0700 Subject: Problem stsetch SNF 2010-05-28 11:41:14: Message-ID: From mtan at snf.stanford.edu Fri May 28 11:41:19 2010 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Fri, 28 May 2010 11:41:19 -0700 Subject: Comment stsetch SNF 2010-05-28 11:41:18: Message-ID: From eenriquez at snf.stanford.edu Fri May 28 15:02:34 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 28 May 2010 15:02:34 -0700 Subject: Comment stsetch SNF 2010-05-28 15:02:33: Update He leak Message-ID: Replaced electrode o-ring (between electrode plate and cooling block). Helium cooling pressure improved from around 6 Torr to (8.3 - 9 )T. From jwpchen at snf.stanford.edu Sun May 30 07:49:19 2010 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Sun, 30 May 2010 07:49:19 -0700 Subject: Problem stsetch SNF 2010-05-30 07:49:19: wafer broken, He pressure low Message-ID: My 1st wafer finished with no mishaps, but the 2nd identical wafer shattered in less than 1hr while using holder. Not sure if it is related to helium cooling. Helium pressure was 3.5-4.5 before wafer broke. Wafer is thick type with DEEP recipe. I cannot see pieces in the o-ring area, but helium cooling pressure with my dummy wafer now reads negative. Some pieces are visible outside the chuck area. My sincere apologies...