From xzhuan1 at snf.stanford.edu Thu Sep 2 15:56:07 2010 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Thu, 2 Sep 2010 15:56:07 -0700 Subject: Problem stsetch SNF 2010-09-02 15:56:07: white o-ring too small Message-ID: it's extremely difficult to fit the white o-ring to the wafer holder. can we get some o-rings with slightly larger size? From nharjee at snf.stanford.edu Thu Sep 2 16:11:42 2010 From: nharjee at snf.stanford.edu (nharjee at snf.stanford.edu) Date: Thu, 2 Sep 2010 16:11:42 -0700 Subject: Comment stsetch SNF 2010-09-02 16:11:42: Fitting white o-rings Message-ID: User xzhuan1 reported that the new white o-rings are too small for the aluminum holder. I've found that stretching the o-ring slightly before placing it into the holder allows it to fit. Not ideal, but it works. From jwpchen at snf.stanford.edu Fri Sep 3 02:30:46 2010 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Fri, 3 Sep 2010 02:30:46 -0700 Subject: Problem stsetch SNF 2010-09-03 02:30:45: one clamp finger tip fell off Message-ID: one clamp finger tip must have become detached after process, then came out when my wafer unloaded. please check your helium flow closely since the clamp pressure may no longer be even. i left the finger tip in the tray for the aluminum holder From jwpchen at snf.stanford.edu Fri Sep 3 02:32:27 2010 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Fri, 3 Sep 2010 02:32:27 -0700 Subject: Comment stsetch SNF 2010-09-03 02:32:27: broken wafer shards in load lock Message-ID: noticed a bit more abundant than usual amount of wafer pieces at the bottom of load lock chamber, not affecting process so just noting it From eenriquez at snf.stanford.edu Tue Sep 7 11:33:23 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 7 Sep 2010 11:33:23 -0700 Subject: Problem stsetch SNF 2010-09-03 02:30:45: one clamp finger tip fell off Message-ID: Replaced fingers and lip seal. Ran O2 plasma. From eenriquez at snf.stanford.edu Tue Sep 7 12:07:32 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 7 Sep 2010 12:07:32 -0700 Subject: Comment stsetch SNF 2010-09-03 02:32:27: broken wafer shards in load lock Message-ID: Cleaned the loadlock From eenriquez at snf.stanford.edu Tue Sep 7 12:09:00 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 7 Sep 2010 12:09:00 -0700 Subject: Problem stsetch SNF 2010-09-02 15:56:07: white o-ring too small Message-ID: Replaced the white o-ring with correct size black o-ring From eenriquez at snf.stanford.edu Tue Sep 7 12:09:05 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 7 Sep 2010 12:09:05 -0700 Subject: Comment stsetch SNF 2010-09-02 16:11:42: Fitting white o-rings Message-ID: Replaced the white o-ring with correct size black o-ring From eenriquez at snf.stanford.edu Wed Sep 15 15:58:09 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 15 Sep 2010 15:58:09 -0700 Subject: Shutdown stsetch SNF 2010-09-15 15:58:09: SF6 MFC problem Message-ID: During the monthly PM, we found that the SF6 flow has increased by about 20% from 1 month ago. An MFC has been sent out for clean and recalibration . It will be here on Friday. From mtang at snf.stanford.edu Fri Sep 17 16:58:47 2010 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 17 Sep 2010 16:58:47 -0700 Subject: Shutdown stsetch SNF 2010-09-15 15:58:09: SF6 MFC problem Message-ID: Elmer replaced the MFC with a recalibrated unit. The pumping speed test indicates the average flow value is good. The MFC seems a bit unstable -- overshooting and undershooting during process. But the average pressure is where we should be (28 mt for deep.) According to experts, the SF6 flow is not critical, but the pressure is. Process qual was done, but not yet analyzed. In the meantime, it is back over for general use. We will keep an eye on the SF6 MFC. Please report any problems observed. From mtang at snf.stanford.edu Fri Sep 17 20:31:52 2010 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Fri, 17 Sep 2010 20:31:52 -0700 Subject: Comment stsetch SNF 2010-09-17 20:31:52: Qual following SF6 MFC recal Message-ID: Results: Average Silicon ER = 2.09 microns/min Silicon etch nonuniformity = 4.9% Resist ER = 220 A/min Selectivity of silicon to resist = 95 Results are normal From jwpchen at snf.stanford.edu Mon Sep 20 00:05:37 2010 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Mon, 20 Sep 2010 00:05:37 -0700 Subject: Comment stsetch SNF 2010-09-20 00:05:37: He flow rates as quals data Message-ID: Could staff always post the following after a system quals as guidelines: (1) He base flow rate with ideal seal (2) He reference flow rate with good wafer on lip seal (3) He reference flow rate with good wafer in Al holder (4) He max flow rate with no wafer The He base flow rate appears to drift over the weeks... now it's about 1.6. The He pressure reading appears to have little indication on the level of cooling. With He flow rates included in the quals data, users can estimate the level of cooling actually available to the wafer. From jcdoll at snf.stanford.edu Mon Sep 20 09:06:46 2010 From: jcdoll at snf.stanford.edu (jcdoll at snf.stanford.edu) Date: Mon, 20 Sep 2010 09:06:46 -0700 Subject: Problem stsetch SNF 2010-09-20 09:06:45: 120W vs 12W Platen Power Message-ID: The platen power on our stsetch recipes (~120W) is about 10x higher than comparable recipes on all other STS Multiplex systems that I've looked up (e.g. Berkeley runs 12-14W platen power). Elmer is looking into how the actual platen power compares to the power specified in the recipe. This is only an issue for recipe development/comparison with other tools. From jcdoll at snf.stanford.edu Mon Sep 20 16:21:09 2010 From: jcdoll at snf.stanford.edu (jcdoll at snf.stanford.edu) Date: Mon, 20 Sep 2010 16:21:09 -0700 Subject: Comment stsetch SNF 2010-09-20 16:21:08: Platen power resolved Message-ID: Reread tool instructions - 10x multiplier in platen power is mentioned. Verified platen power on meter next to the tool during a test run. Origin of 10x multiplier is unclear, but resolves issue of comparing recipes with other systems. From mtang at snf.stanford.edu Tue Sep 21 07:47:24 2010 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 21 Sep 2010 07:47:24 -0700 Subject: Problem stsetch SNF 2010-09-20 09:06:45: 120W vs 12W Platen Power Message-ID: Reread tool instructions - 10x multiplier in platen power is mentioned. Verified platen power on meter next to the tool during a test run. Origin of 10x multiplier is unclear, but resolves issue of comparing recipes with other systems. From eenriquez at snf.stanford.edu Tue Sep 21 07:47:49 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 21 Sep 2010 07:47:49 -0700 Subject: Problem stsetch SNF 2010-09-20 09:06:45: 120W vs 12W Platen Power Message-ID: This has been resolved From eenriquez at snf.stanford.edu Tue Sep 21 07:48:07 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 21 Sep 2010 07:48:07 -0700 Subject: Problem stsetch SNF 2010-08-29 22:15:03: DO NOT CHANGE STANDARD RECIPES! Message-ID: Archived From mtang at snf.stanford.edu Tue Sep 21 07:52:50 2010 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Tue, 21 Sep 2010 07:52:50 -0700 Subject: Comment stsetch SNF 2010-09-20 00:05:37: He flow rates as quals data Message-ID: Good point, especially about the holder. Team Etch is in the process of (re)defining process and machine quals, so will add this into the mix. From eenriquez at snf.stanford.edu Thu Sep 23 14:00:33 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 23 Sep 2010 14:00:33 -0700 Subject: Comment stsetch SNF 2010-07-09 12:21:27: Qual after He valve adjustment Message-ID: Archived From eenriquez at snf.stanford.edu Thu Sep 23 14:00:46 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 23 Sep 2010 14:00:46 -0700 Subject: Comment stsetch SNF 2010-07-13 16:34:26: Qual after He adjust Message-ID: Archived From eenriquez at snf.stanford.edu Thu Sep 23 14:00:58 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 23 Sep 2010 14:00:58 -0700 Subject: Comment stsetch SNF 2010-08-11 12:27:48: Monthly PM completed Message-ID: Archived From eenriquez at snf.stanford.edu Thu Sep 23 14:01:13 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 23 Sep 2010 14:01:13 -0700 Subject: Comment stsetch SNF 2010-08-18 18:54:56: Update eating resist Message-ID: Archived From eenriquez at snf.stanford.edu Thu Sep 23 14:08:19 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 23 Sep 2010 14:08:19 -0700 Subject: Comment stsetch SNF 2010-09-20 16:21:08: Platen power resolved Message-ID: Archived From eenriquez at snf.stanford.edu Fri Sep 24 08:00:43 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 24 Sep 2010 08:00:43 -0700 Subject: Comment stsetch SNF 2010-08-28 10:04:05: Update? Message-ID: Archived From eenriquez at snf.stanford.edu Fri Sep 24 08:00:55 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 24 Sep 2010 08:00:55 -0700 Subject: Comment stsetch SNF 2010-08-28 18:14:50: APC setpoint for DEEP recipe Message-ID: Archived From latta at snf.stanford.edu Fri Sep 24 14:22:26 2010 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 24 Sep 2010 14:22:26 -0700 Subject: Comment stsetch SNF 2010-08-20 15:58:34: Quals before and after lip seal replacement Message-ID: archived From eenriquez at snf.stanford.edu Thu Sep 30 08:01:19 2010 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 30 Sep 2010 08:01:19 -0700 Subject: Comment stsetch SNF 2010-09-30 08:01:19: Helium metering valve Message-ID: Installed a metering valve to better control the backside helium cooling flow.