From latta at snf.stanford.edu Fri Apr 1 16:03:47 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 1 Apr 2011 16:03:47 -0700 Subject: Comment stsetch SNF 2011-03-04 16:07:57: Mar quals Message-ID: newer qual posted From latta at snf.stanford.edu Fri Apr 1 16:04:48 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 1 Apr 2011 16:04:48 -0700 Subject: Comment stsetch SNF 2011-04-01 16:04:47: April quick check qual Message-ID: DEEP 00:10:00 1 Si ER = 2.13um/min, PR ER = 211A, Sel Si : PR = 101 : 1 From eenriquez at snf.stanford.edu Mon Apr 4 09:33:19 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 4 Apr 2011 09:33:19 -0700 Subject: Comment stsetch SNF 2011-04-04 09:33:18: Updated qualification charts Message-ID: From latta at snf.stanford.edu Thu Apr 7 14:43:36 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:43:36 -0700 Subject: Comment stsetch SNF 2011-01-26 15:20:56: Grass check for SMOOSHAL Message-ID: archived- no further grass complaints From latta at snf.stanford.edu Thu Apr 7 14:48:05 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:48:05 -0700 Subject: Comment stsetch SNF 2011-03-07 12:54:38: Updated qual charts Message-ID: even newer updated chart posted From latta at snf.stanford.edu Thu Apr 7 14:48:39 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:48:39 -0700 Subject: Comment stsetch SNF 2011-03-09 09:15:45: Maintenance work Message-ID: archived From latta at snf.stanford.edu Thu Apr 7 14:49:48 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:49:48 -0700 Subject: Comment stsetch SNF 2010-10-05 20:10:29: need new aluminum holders Message-ID: archived From latta at snf.stanford.edu Thu Apr 7 14:50:13 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:50:13 -0700 Subject: Comment stsetch SNF 2010-11-02 06:26:44: RF coil power variable? Message-ID: repaired awhile ago From latta at snf.stanford.edu Thu Apr 7 14:51:19 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:51:19 -0700 Subject: Problem stsetch SNF 2010-11-11 19:31:45: severe grass formation in smooshal recipe Message-ID: test done at 15.5 mins- little grass formation From latta at snf.stanford.edu Thu Apr 7 14:52:14 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:52:14 -0700 Subject: Comment stsetch SNF 2010-12-06 00:41:52: Grass Issue is Worse than Before Message-ID: old msg- grass formation issue has been resolved From latta at snf.stanford.edu Thu Apr 7 14:53:04 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 7 Apr 2011 14:53:04 -0700 Subject: Problem stsetch SNF 2010-12-10 16:00:49: grass on whole wafer Message-ID: old msg- no longer an issue From jasmine at snf.stanford.edu Mon Apr 11 14:10:40 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Mon, 11 Apr 2011 14:10:40 -0700 Subject: Comment stsetch SNF 2011-04-11 14:10:39: very leaky He flow..between 2-5 Message-ID: From eenriquez at snf.stanford.edu Mon Apr 11 15:05:53 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 11 Apr 2011 15:05:53 -0700 Subject: Comment stsetch SNF 2011-04-11 14:10:39: very leaky He flow..between 2-5 Message-ID: Adjusted the He bypass flow from 2.6 to 2.2 From eenriquez at snf.stanford.edu Tue Apr 12 10:17:29 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 12 Apr 2011 10:17:29 -0700 Subject: Comment stsetch SNF 2011-04-12 10:17:29: Completed monthly PM Message-ID: Replaced 8 teflon screw caps. From eenriquez at snf.stanford.edu Tue Apr 12 10:17:35 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 12 Apr 2011 10:17:35 -0700 Subject: Comment stsetch SNF 2011-03-07 09:42:38: Completed monthly PM Message-ID: From jasmine at snf.stanford.edu Wed Apr 13 19:17:09 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Wed, 13 Apr 2011 19:17:09 -0700 Subject: Comment stsetch SNF 2011-04-13 19:17:09: Message-ID: A smell coming from around the sts. Unsure what???? Myself, Andre Grahamand Ben Chui smellt it From grahamab at snf.stanford.edu Thu Apr 14 20:31:10 2011 From: grahamab at snf.stanford.edu (grahamab at snf.stanford.edu) Date: Thu, 14 Apr 2011 20:31:10 -0700 Subject: Comment stsetch SNF 2011-04-14 20:31:10: similar smell as last night Message-ID: fairly strong odor around the sts. similar to last night, but still not sure what it is or where it's coming from. hoping it dissipates like last night.... From chen0622 at snf.stanford.edu Fri Apr 15 08:40:17 2011 From: chen0622 at snf.stanford.edu (chen0622 at snf.stanford.edu) Date: Fri, 15 Apr 2011 08:40:17 -0700 Subject: Shutdown stsetch SNF 2011-04-15 08:40:17: previous user's wafer broken and left inside Message-ID: From eenriquez at snf.stanford.edu Fri Apr 15 15:39:22 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 15 Apr 2011 15:39:22 -0700 Subject: Shutdown stsetch SNF 2011-04-15 15:39:21: High chamber leak rate Message-ID: Leak rate after recovering the broken wafer was about 350 mT/min. Found a leak at the chamber o-ring (bottom of ceramic chamber). Leak rate now is at 40 mT/min. The spec is < 5mT/min and is normally less than 2. Ran O2 plasma for 20 min but the leak rate is not improving. From eenriquez at snf.stanford.edu Fri Apr 15 15:39:45 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 15 Apr 2011 15:39:45 -0700 Subject: Shutdown stsetch SNF 2011-04-15 08:40:17: previous user's wafer broken and left inside Message-ID: Recovered the user's wafer and cleaned the chamber. From cbaxter at snf.stanford.edu Sun Apr 17 07:48:48 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 17 Apr 2011 07:48:48 -0700 Subject: Shutdown stsetch SNF 2011-04-15 15:39:21: High chamber leak rate Message-ID: He leak check upper chamber and found 2 decade leak on the top chamber lid, changed top chmaber lid o-ring and re-verified with he leak detector. Ran 10 mins chamber leak up and it pass at 2mt per min.. From jasmine at snf.stanford.edu Thu Apr 21 14:58:13 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Thu, 21 Apr 2011 14:58:13 -0700 Subject: Shutdown stsetch SNF 2011-04-21 14:58:12: Message-ID: My wafer is stuck in the chamber. I loaded the wafer and was ready to process but alarams came up and I noticed the chamber didn't even pump down. INfact I can even open the load lock chamber...Very wierd! From eenriquez at snf.stanford.edu Fri Apr 22 09:40:57 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 22 Apr 2011 09:40:57 -0700 Subject: Shutdown stsetch SNF 2011-04-21 14:58:12: Message-ID: Reset the pump breakers. Ran O2 plasma for 10 minutes with no problems. From jasmine at snf.stanford.edu Sat Apr 23 00:17:15 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Sat, 23 Apr 2011 00:17:15 -0700 Subject: Shutdown stsetch SNF 2011-04-23 00:17:15: wafer broke in the sts Message-ID: wafer broken in the chamber From cbaxter at snf.stanford.edu Mon Apr 25 17:46:32 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Mon, 25 Apr 2011 17:46:32 -0700 Subject: Shutdown stsetch SNF 2011-04-23 00:17:15: wafer broke in the sts Message-ID: Removed broken wafer and wiped down chamber with water and ipa. Ran 10mins o2 clean. From dgunning at snf.stanford.edu Tue Apr 26 02:07:04 2011 From: dgunning at snf.stanford.edu (dgunning at snf.stanford.edu) Date: Tue, 26 Apr 2011 02:07:04 -0700 Subject: Shutdown stsetch SNF 2011-04-26 02:07:04: broken wafer Message-ID: etch ran fine - wafer broke during unloading.. From cbaxter at snf.stanford.edu Tue Apr 26 08:48:25 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Tue, 26 Apr 2011 08:48:25 -0700 Subject: Shutdown stsetch SNF 2011-04-26 02:07:04: broken wafer Message-ID: recoved wafer pieces. When running long etches, they should be staggered runs as not to let the wafer stick to the chuck due to it being too thin. Running O2 clean.