From xzhuan1 at snf.stanford.edu Tue Aug 2 12:02:30 2011 From: xzhuan1 at snf.stanford.edu (xzhuan1 at snf.stanford.edu) Date: Tue, 2 Aug 2011 12:02:30 -0700 Subject: Shutdown stsetch SNF 2011-08-02 12:02:29: wafer broken in chamber, please take out the broken pieces for me. Message-ID: I took out most of the pieces on the wafer carrier. But there are still a few remaining in the chamber. Please take them out. They are very valuable pieces to me! From mdickey at snf.stanford.edu Wed Aug 3 08:50:24 2011 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Wed, 3 Aug 2011 08:50:24 -0700 Subject: Shutdown stsetch SNF 2011-08-02 12:02:29: wafer broken in chamber, please take out the broken pieces for me. Message-ID: Retrieved broken pieces, Ramping system back up From mdickey at snf.stanford.edu Wed Aug 3 08:58:18 2011 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Wed, 3 Aug 2011 08:58:18 -0700 Subject: Comment stsetch SNF 2011-08-03 08:58:17: O2 clean Message-ID: Running O2 clean recipe From ehsans at snf.stanford.edu Sat Aug 6 11:47:33 2011 From: ehsans at snf.stanford.edu (ehsans at snf.stanford.edu) Date: Sat, 6 Aug 2011 11:47:33 -0700 Subject: Shutdown stsetch SNF 2011-08-06 11:47:33: Wafer Broke in Chamber Message-ID: I was clearing 8.5 um of poly when my wafer broke in the chamber. Unloading removed half of it, but some pieces are still in there. From cbaxter at snf.stanford.edu Sat Aug 6 21:05:06 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sat, 6 Aug 2011 21:05:06 -0700 Subject: Shutdown stsetch SNF 2011-08-06 11:47:33: Wafer Broke in Chamber Message-ID: Vented chamber and removed broken wafer chips. Ran 30mins o2 plasma. From mtan at snf.stanford.edu Sun Aug 7 12:37:01 2011 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Sun, 7 Aug 2011 12:37:01 -0700 Subject: Problem stsetch SNF 2011-08-07 12:37:00: later etching Message-ID: Ran deep recipe earlier this week up till friday and it was fine. Ran deep recipe today (sunday), and saw huge under cut under SEM. From dkozak at snf.stanford.edu Wed Aug 10 00:50:28 2011 From: dkozak at snf.stanford.edu (dkozak at snf.stanford.edu) Date: Wed, 10 Aug 2011 00:50:28 -0700 Subject: Comment stsetch SNF 2011-08-10 00:50:28: PR burned off on two wafers Message-ID: Used 7 um spr 220-7 resist as mask. After 4 hours baking at 110C. Ran one wafer with deep_smooth for 2 hours, and another wafer with fastdeep for 2 hours. Used wafer holder on both wafers. Gas flow rates were consistent with previous runs. Both wafers had PR completely burned off after approx. 1.5 hours of etching. From mahnaz at stanford.edu Wed Aug 10 07:58:24 2011 From: mahnaz at stanford.edu (Mahnaz Mansourpour) Date: Wed, 10 Aug 2011 07:58:24 -0700 Subject: Comment stsetch SNF 2011-08-10 00:50:28: PR burned off on two wafers In-Reply-To: <20110810075028.F346E456DE2@smtp-unencrypted.stanford.edu> References: <20110810075028.F346E456DE2@smtp-unencrypted.stanford.edu> Message-ID: <4E429C90.9000205@stanford.edu> Hi Why would you bake the resist for 4 hours? Did you think that makes a harder? You made the resist to crack and created many micro crack in it. talk to Nancy or me if you want help. mahnaz On 8/10/2011 12:50 AM, dkozak at snf.stanford.edu wrote: > Used 7 um spr 220-7 resist as mask. After 4 hours baking at 110C. Ran one wafer with deep_smooth for 2 hours, and another wafer with fastdeep for 2 hours. Used wafer holder on both wafers. Gas flow rates were consistent with previous runs. > Both wafers had PR completely burned off after approx. 1.5 hours of etching. > From zpatel at snf.stanford.edu Wed Aug 10 12:03:22 2011 From: zpatel at snf.stanford.edu (zpatel at snf.stanford.edu) Date: Wed, 10 Aug 2011 12:03:22 -0700 Subject: Comment stsetch SNF 2011-08-10 12:03:21: He low when plasma strikes 3.47 Message-ID: From eenriquez at snf.stanford.edu Wed Aug 10 18:08:45 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 10 Aug 2011 18:08:45 -0700 Subject: Comment stsetch SNF 2011-08-10 18:08:44: Completed monthly PM Message-ID: Found the helium pressure had been turned down to about 6 Torr instead of the maximum of 9.9 T. When I adjusted the He pressure to the correct setting, the helium flow increased to 5.0. This indicates a huge helium cooling leak. When I opened the chamber, I found wafer chips underneath the wafer lifter. This caused the lifter to sit slightly above the surface of the electrode. Helium readings now are back to normal. 2.3 : With the wafer loaded and before the process starts 3.7 - 4.0 : During process (no wafer holder) Nancy will run another test tomorrow From latta at snf.stanford.edu Thu Aug 11 11:02:41 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:02:41 -0700 Subject: Comment stsetch SNF 2011-06-23 09:46:41: Completed monthly PM Message-ID: archived From latta at snf.stanford.edu Thu Aug 11 11:03:11 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:03:11 -0700 Subject: Problem stsetch SNF 2011-07-19 01:45:04: Severe grass formed Message-ID: old problem- resolved awhile ago From latta at snf.stanford.edu Thu Aug 11 11:03:23 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:03:23 -0700 Subject: Comment stsetch SNF 2011-08-03 08:58:17: O2 clean Message-ID: archived From latta at snf.stanford.edu Thu Aug 11 11:04:18 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:04:18 -0700 Subject: Comment stsetch SNF 2011-08-10 12:03:21: He low when plasma strikes 3.47 Message-ID: Elmer found He pressure turn down from 9.9 to about 6.0 From latta at snf.stanford.edu Thu Aug 11 11:21:49 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:21:49 -0700 Subject: Problem stsetch SNF 2011-08-07 12:37:00: later etching Message-ID: Elmer turned He pressure to corrat setting, replaced lip seal and removed chips from around the wafer lifter. Leak rate should be acceptable. Qual run and posted. From latta at snf.stanford.edu Thu Aug 11 11:22:27 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:22:27 -0700 Subject: Comment stsetch SNF 2011-08-10 00:50:28: PR burned off on two wafers Message-ID: probable due to the He low flow and leak at the lifter. From latta at snf.stanford.edu Thu Aug 11 11:24:33 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 11 Aug 2011 11:24:33 -0700 Subject: Comment stsetch SNF 2011-08-11 11:24:32: qual run after repair Message-ID: DEEP 00:10:00 Si ER =2.07um/min PR ER = 172A/min Sel = 120:1 This result is consistent with the last quals run. From mtan at snf.stanford.edu Thu Aug 11 15:20:19 2011 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Thu, 11 Aug 2011 15:20:19 -0700 Subject: Problem stsetch SNF 2011-08-11 15:20:19: platen power out of tolerance Message-ID: From eenriquez at snf.stanford.edu Fri Aug 12 09:11:46 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 12 Aug 2011 09:11:46 -0700 Subject: Problem stsetch SNF 2011-08-11 15:20:19: platen power out of tolerance Message-ID: No problem found. Ran the deep recipe for 20 min with no problems. Possible cause of the platen power out of tolerance fault is a high helium leak rate. The system turns the RF power off to the platen if the cooling He leak rate is too high. From mtan at snf.stanford.edu Fri Aug 12 10:59:45 2011 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Fri, 12 Aug 2011 10:59:45 -0700 Subject: Problem stsetch SNF 2011-08-12 10:59:44: coil out of tolerance Message-ID: getting some intermitten issues with the coil out of tolerance alarm. From mtan at snf.stanford.edu Wed Aug 17 18:11:12 2011 From: mtan at snf.stanford.edu (mtan at snf.stanford.edu) Date: Wed, 17 Aug 2011 18:11:12 -0700 Subject: Problem stsetch SNF 2011-08-17 18:11:12: drop in etch rate Message-ID: The etch rate seems to be dropping. on Monday 350um was etched in 6 hours Tuesday it became 6.5 to 7 hours and today I was not able to etch a through wafer in 8 hours. From latta at snf.stanford.edu Thu Aug 18 16:04:03 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 18 Aug 2011 16:04:03 -0700 Subject: Comment stsetch SNF 2011-08-18 16:04:02: Qual check after report of low ER Message-ID: DEEP 00:10:00 Si ER =2.1um/min PR ER = 198A/min Sel = 106:1 ER actually higher than qual last week..... From latta at snf.stanford.edu Thu Aug 18 16:04:22 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 18 Aug 2011 16:04:22 -0700 Subject: Problem stsetch SNF 2011-08-12 10:59:44: coil out of tolerance Message-ID: healed itself... From latta at snf.stanford.edu Tue Aug 23 15:05:40 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 23 Aug 2011 15:05:40 -0700 Subject: Problem stsetch SNF 2011-08-17 18:11:12: drop in etch rate Message-ID: Not sure what's going on. Qual was fine. From barlian at snf.stanford.edu Fri Aug 26 20:45:03 2011 From: barlian at snf.stanford.edu (barlian at snf.stanford.edu) Date: Fri, 26 Aug 2011 20:45:03 -0700 Subject: Problem stsetch SNF 2011-08-26 20:45:03: Wafer broken in the chamber Message-ID: A little piece of silicon broke during etching (about 1.5x1.5cm in size). From cbaxter at snf.stanford.edu Sat Aug 27 21:29:07 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sat, 27 Aug 2011 21:29:07 -0700 Subject: Problem stsetch SNF 2011-08-26 20:45:03: Wafer broken in the chamber Message-ID: Vented chamber eariler today, but did not see any wafer chip inside the chamber.. From latta at snf.stanford.edu Tue Aug 30 15:07:13 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 30 Aug 2011 15:07:13 -0700 Subject: Comment stsetch SNF 2011-08-30 15:07:13: New 0-ring for the holder needed Message-ID: Old one is pretty flat....