Comment stsetch SNF 2011-08-10 00:50:28: PR burned off on two wafers

dkozak at snf.stanford.edu dkozak at snf.stanford.edu
Wed Aug 10 00:50:28 PDT 2011


Used 7 um spr 220-7 resist as mask.  After 4 hours baking at 110C.  Ran one wafer with deep_smooth for 2 hours, and another wafer with fastdeep for 2 hours.  Used wafer holder on both wafers.  Gas flow rates were consistent with previous runs.  
Both wafers had PR completely burned off after approx. 1.5 hours of etching.




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