From ashutosh at snf.stanford.edu Thu Mar 3 18:05:40 2011 From: ashutosh at snf.stanford.edu (ashutosh at snf.stanford.edu) Date: Thu, 3 Mar 2011 18:05:40 -0800 Subject: Shutdown stsetch SNF 2011-03-03 18:05:40: ICP transfer mode entry failed communication lost Message-ID: From eenriquez at snf.stanford.edu Fri Mar 4 08:33:11 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 4 Mar 2011 08:33:11 -0800 Subject: Shutdown stsetch SNF 2011-03-03 18:05:40: ICP transfer mode entry failed communication lost Message-ID: Reset the computer. Ran Deep recipe with no problems. From latta at snf.stanford.edu Fri Mar 4 16:02:57 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 4 Mar 2011 16:02:57 -0800 Subject: Comment stsetch SNF 2011-01-26 10:12:39: Completed monthly PM Message-ID: new pm completed and noted From latta at snf.stanford.edu Fri Mar 4 16:07:57 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Fri, 4 Mar 2011 16:07:57 -0800 Subject: Comment stsetch SNF 2011-03-04 16:07:57: Mar quals Message-ID: O2CLEAN run for 30 min, DEEP run for 15 min for seasoning Three wafersrun for 10 min, DEEP, with the following results; 1 Si ER = 1.82um/min, PR ER = 199A, Sel Si : PR = 91 : 1 2 Si ER = 1.88um/min, PR ER = 199A, Sel Si : PR = 94 : 1 3 Si ER = 1.82um/min, PR ER = 210A, Sel Si : PR = 87 : 1 From ashutosh at snf.stanford.edu Fri Mar 4 16:13:08 2011 From: ashutosh at snf.stanford.edu (ashutosh at snf.stanford.edu) Date: Fri, 4 Mar 2011 16:13:08 -0800 Subject: Problem stsetch SNF 2011-03-04 16:13:07: ICP Process failed interlock tripped Message-ID: Wafer inside. Next user kindly unload it in its wafer box. Thanks. From cbaxter at snf.stanford.edu Sun Mar 6 18:59:19 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 6 Mar 2011 18:59:19 -0800 Subject: Problem stsetch SNF 2011-03-04 16:13:07: ICP Process failed interlock tripped Message-ID: I ran o2 plasma and smodeepr recipes w/out problem. From eenriquez at snf.stanford.edu Mon Mar 7 09:41:46 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 7 Mar 2011 09:41:46 -0800 Subject: Comment stsetch SNF 2011-01-26 11:16:09: Replaced Freon 318 cylinder Message-ID: Archived From eenriquez at snf.stanford.edu Mon Mar 7 09:42:38 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 7 Mar 2011 09:42:38 -0800 Subject: Comment stsetch SNF 2011-03-07 09:42:38: Completed monthly PM Message-ID: From eenriquez at snf.stanford.edu Mon Mar 7 12:54:39 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 7 Mar 2011 12:54:39 -0800 Subject: Comment stsetch SNF 2011-03-07 12:54:38: Updated qual charts Message-ID: From ashutosh at snf.stanford.edu Mon Mar 7 16:02:51 2011 From: ashutosh at snf.stanford.edu (ashutosh at snf.stanford.edu) Date: Mon, 7 Mar 2011 16:02:51 -0800 Subject: Shutdown stsetch SNF 2011-03-07 16:02:51: broken wafer inside Message-ID: From eenriquez at snf.stanford.edu Tue Mar 8 09:51:00 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 8 Mar 2011 09:51:00 -0800 Subject: Shutdown stsetch SNF 2011-03-07 16:02:51: broken wafer inside Message-ID: The wafer broke during the process. Recovered the wafer and ran O2 plasma. From eenriquez at snf.stanford.edu Wed Mar 9 09:15:45 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 9 Mar 2011 09:15:45 -0800 Subject: Comment stsetch SNF 2011-03-09 09:15:45: Maintenance work Message-ID: Replaced DI water filter. Noticed during the monthly PM that the water conductivity had risen to 0.7 uS. It is now 0.04 uS after DI filter change. Ran the DEEP recipe without any problems. From ehsans at snf.stanford.edu Sun Mar 13 07:06:33 2011 From: ehsans at snf.stanford.edu (ehsans at snf.stanford.edu) Date: Sun, 13 Mar 2011 07:06:33 -0700 Subject: Problem stsetch SNF 2011-03-13 07:06:32: Error and Big Jumps in Helium Flow Message-ID: The Helium flow jumped wildly between 2.5 and 5.5. I also got an error: "ICP Process DEEP on 7673 failed - Interlock Tripped" After getting the error I took my wafer out, put it back in, and the process went well. The Helium problem persisted over the four wafers that I etched. My etch rate was 3.4 um/min using DEEP. From jasmine at snf.stanford.edu Mon Mar 14 13:58:09 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Mon, 14 Mar 2011 13:58:09 -0700 Subject: Problem stsetch SNF 2011-03-14 13:58:09: He flow keeps fluctuating during etch Message-ID: it worked fine last week and now its all messed up.. From eenriquez at snf.stanford.edu Mon Mar 14 14:45:55 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Mar 2011 14:45:55 -0700 Subject: Problem stsetch SNF 2011-03-13 07:06:32: Error and Big Jumps in Helium Flow Message-ID: Wiped down the lip seal. Now He flow during the process is 3.65 -3.7. From eenriquez at snf.stanford.edu Mon Mar 14 14:46:03 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 14 Mar 2011 14:46:03 -0700 Subject: Problem stsetch SNF 2011-03-14 13:58:09: He flow keeps fluctuating during etch Message-ID: Wiped down the lip seal. Now He flow during the process is 3.65 -3.7. From bchui at snf.stanford.edu Tue Mar 15 15:42:30 2011 From: bchui at snf.stanford.edu (bchui at snf.stanford.edu) Date: Tue, 15 Mar 2011 15:42:30 -0700 Subject: Problem stsetch SNF 2011-03-15 15:42:29: Frequent interlock problems Message-ID: My wafer and other users' wafers are both encountering frequent interlock trip errors leading to the recipe being aborted. The frequency is about every 1 to 2 hours. In one case the "DI conductivity interlock alarm" error msg showed. From ashutosh at snf.stanford.edu Tue Mar 15 18:22:59 2011 From: ashutosh at snf.stanford.edu (ashutosh at snf.stanford.edu) Date: Tue, 15 Mar 2011 18:22:59 -0700 Subject: Shutdown stsetch SNF 2011-03-15 18:22:59: wafer in the handler Message-ID: Vent timed out. Kindly remove my wafer into its box. Thanks. From eenriquez at snf.stanford.edu Wed Mar 16 09:12:09 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 16 Mar 2011 09:12:09 -0700 Subject: Shutdown stsetch SNF 2011-03-15 18:22:59: wafer in the handler Message-ID: Found a piece of lint free paper on the load lock o-ring. The LL was unable to pump down. Removed piece of paper. From latta at snf.stanford.edu Wed Mar 16 14:58:38 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 14:58:38 -0700 Subject: Problem stsetch SNF 2010-10-30 01:00:18: Grass, grass, grass Message-ID: Found two of the screws that suppor the clamp fingers had lost their teflon cap (worn through). Exposed metal is a possible cause for grassing. From latta at snf.stanford.edu Wed Mar 16 14:59:00 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 14:59:00 -0700 Subject: Comment stsetch SNF 2010-11-03 12:15:19: grass only for > 1-2 hour etches Message-ID: Found two of the screws that suppor the clamp fingers had lost their teflon cap (worn through). Exposed metal is a possible cause for grassing. From latta at snf.stanford.edu Wed Mar 16 14:59:11 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 14:59:11 -0700 Subject: Comment stsetch SNF 2010-12-01 18:36:17: Update grass problem Message-ID: archived From latta at snf.stanford.edu Wed Mar 16 15:00:50 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 15:00:50 -0700 Subject: Problem stsetch SNF 2010-07-17 07:46:20: Wafer-to-wafer etch rate is not constant Message-ID: Mar quals ok From latta at snf.stanford.edu Wed Mar 16 15:01:04 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 15:01:04 -0700 Subject: Comment stsetch SNF 2010-08-20 16:17:00: Results for PR etch rate tests Message-ID: ok now From latta at snf.stanford.edu Wed Mar 16 15:01:24 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 16 Mar 2011 15:01:24 -0700 Subject: Problem stsetch SNF 2010-11-01 20:55:59: Etch rate decreasing + grass Message-ID: ok now From eenriquez at snf.stanford.edu Wed Mar 16 19:27:49 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 16 Mar 2011 19:27:49 -0700 Subject: Comment stsetch SNF 2011-03-16 19:27:48: Update interlock problem Message-ID: Still trying to troubleshoot the interlock problem. The system seems to be OK for short etches but not for processes that are longer than 1 hour. As a work around, if you need to run a process that is longer than 1 hour and the system prematurely stops the process because of a fault. Press Alt and G on the keyboard. This will bring up the machine log. Check the time on the log to see when your process started and when it faulted out. Subtract that amount of time from your process time and then resume processing. From wonukjo at snf.stanford.edu Thu Mar 17 05:19:35 2011 From: wonukjo at snf.stanford.edu (wonukjo at snf.stanford.edu) Date: Thu, 17 Mar 2011 05:19:35 -0700 Subject: Problem stsetch SNF 2011-03-17 05:19:34: same interlock problem Message-ID: Here is what I did. I first etched resist bonded wafer with aluminum holder. for 80 mins. no interlock error. And I etched another resist bonded wafer without aluminum holder, and keeps aborting recipe giving me the interlock trip error. It first stopped after 40min. and I ketp going and stopped in 12 mins. Another problem was it kept failing to pump put. waited couple of minutes and I tool my wafer out. Now back to aluminum holder, and it runs at least for an hour. From eenriquez at snf.stanford.edu Thu Mar 17 14:13:25 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:13:25 -0700 Subject: Problem stsetch SNF 2011-03-15 15:42:29: Frequent interlock problems Message-ID: The root cause of the problem was the nitrogen purge to the loadlock pump was set too low (border line). The flow would intermittently drop below the trip point and cause an interlock alarm. I verified this by intentionally adjusting the purge below the trip point. This cause the machine to fault out and display the error that we have been seeing. I ran the Deep process for over 2 hours with no problems. From eenriquez at snf.stanford.edu Thu Mar 17 14:13:34 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:13:34 -0700 Subject: Comment stsetch SNF 2011-03-16 19:27:48: Update interlock problem Message-ID: Archived From eenriquez at snf.stanford.edu Thu Mar 17 14:13:41 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:13:41 -0700 Subject: Problem stsetch SNF 2011-03-17 05:19:34: same interlock problem Message-ID: The root cause of the problem was the nitrogen purge to the loadlock pump was set too low (border line). The flow would intermittently drop below the trip point and cause an interlock alarm. I verified this by intentionally adjusting the purge below the trip point. This cause the machine to fault out and display the error that we have been seeing. I ran the Deep process for over 2 hours with no problems. From eenriquez at snf.stanford.edu Thu Mar 17 14:15:47 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:15:47 -0700 Subject: Problem stsetch SNF 2010-11-01 21:49:36: RF coil generator overheat Message-ID: Verified the output of the power supply using a bird watt meter. From eenriquez at snf.stanford.edu Thu Mar 17 14:17:09 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:17:09 -0700 Subject: Comment stsetch SNF 2011-01-12 17:40:38: Quals after shutdown Message-ID: Archived From eenriquez at snf.stanford.edu Thu Mar 17 14:18:45 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 17 Mar 2011 14:18:45 -0700 Subject: Comment stsetch SNF 2011-02-16 11:12:51: Completed the monthly pm Message-ID: Archived