From jasmine at snf.stanford.edu Sun May 1 00:02:16 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Sun, 1 May 2011 00:02:16 -0700 Subject: Shutdown stsetch SNF 2011-05-01 00:02:16: wafer broke in chamber Message-ID: I have a feeling there is something wrong with the machine. About 2 weeks ago, I did the same process and 7 wafers etched well and since then every wafer has broke ( a total of 4 wafers) . Debbie and I did test etches with the holder and all the resist burnt off, so there is something severly wrong with this machine. From cbaxter at snf.stanford.edu Sun May 1 19:15:11 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 1 May 2011 19:15:11 -0700 Subject: Shutdown stsetch SNF 2011-05-01 00:02:16: wafer broke in chamber Message-ID: Vented chamber and removed broken wafer(1/4). I ran two wafers (1 hrs each using deep recipe) and wafer's unload find on one piece. From cbaxter at snf.stanford.edu Sun May 1 21:27:35 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 1 May 2011 21:27:35 -0700 Subject: Shutdown stsetch SNF 2011-05-01 21:27:35: Chamber leak Message-ID: The chambre has a vacuum leak, the turbo can't maintain the 400hrz turbo speed.. From cbaxter at snf.stanford.edu Sun May 1 23:09:03 2011 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 1 May 2011 23:09:03 -0700 Subject: Shutdown stsetch SNF 2011-05-01 21:27:35: Chamber leak Message-ID: The oring on the bottom of the ceramic beljar came off, reseated the oring and pump down w/out problem. Ran a long o2 plasma clean.. From eenriquez at snf.stanford.edu Mon May 2 13:32:38 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 2 May 2011 13:32:38 -0700 Subject: Shutdown stsetch SNF 2011-05-02 13:32:37: No plasma Message-ID: From eenriquez at snf.stanford.edu Tue May 3 11:59:43 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 3 May 2011 11:59:43 -0700 Subject: Shutdown stsetch SNF 2011-05-02 13:32:37: No plasma Message-ID: Part of the RF interlock loop was not being made. It turns out that one of the two electrode "UP" position sensor was borderline. Adjusted the position of the sensor. From eenriquez at snf.stanford.edu Tue May 3 12:00:54 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 3 May 2011 12:00:54 -0700 Subject: Comment stsetch SNF 2011-04-13 19:17:09: Message-ID: Smell has not returned in over two weeks. From eenriquez at snf.stanford.edu Tue May 3 12:01:00 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 3 May 2011 12:01:00 -0700 Subject: Comment stsetch SNF 2011-04-14 20:31:10: similar smell as last night Message-ID: Smell has not returned in over two weeks. From jasmine at snf.stanford.edu Thu May 5 15:47:01 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Thu, 5 May 2011 15:47:01 -0700 Subject: Shutdown stsetch SNF 2011-05-05 15:47:01: unload wafer from chamber Message-ID: need manual unloading of wafer. From eenriquez at snf.stanford.edu Fri May 6 10:23:01 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 6 May 2011 10:23:01 -0700 Subject: Shutdown stsetch SNF 2011-05-05 15:47:01: unload wafer from chamber Message-ID: Unloaded the wafer. From jcdoll at snf.stanford.edu Sat May 7 16:54:14 2011 From: jcdoll at snf.stanford.edu (jcdoll at snf.stanford.edu) Date: Sat, 7 May 2011 16:54:14 -0700 Subject: Shutdown stsetch SNF 2011-05-07 16:54:13: wafer broken in chamber Message-ID: my wafer broke in the chamber partway through the etch. sorry!! From eenriquez at snf.stanford.edu Mon May 9 09:51:21 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 9 May 2011 09:51:21 -0700 Subject: Shutdown stsetch SNF 2011-05-07 16:54:13: wafer broken in chamber Message-ID: Recovered the broken wafer and cleaned the chamber. Ran O2 plasma From ylyang at snf.stanford.edu Mon May 9 15:48:21 2011 From: ylyang at snf.stanford.edu (ylyang at snf.stanford.edu) Date: Mon, 9 May 2011 15:48:21 -0700 Subject: Problem stsetch SNF 2011-05-09 15:48:20: Etch PR fast Message-ID: I use 7um photoresist as the mask. All the photoresist is gone after about 4 hours DEEP etch. From eenriquez at snf.stanford.edu Wed May 11 09:38:12 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 11 May 2011 09:38:12 -0700 Subject: Shutdown stsetch SNF 2011-05-11 09:38:12: High cooling He leak rate Message-ID: Replaced the lip seal but still very high leak rate. Still troubleshooting. From eenriquez at snf.stanford.edu Wed May 11 15:15:04 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 11 May 2011 15:15:04 -0700 Subject: Comment stsetch SNF 2011-05-11 15:15:04: Update high leak rate Message-ID: Found wafer chips underneath the wafer lifter which caused the lifter to stick up above the surface of the chuck. This resulted in the wafer not sitting flush on the lip seal. Leak rate is now OK. In the future, if the backside He flowrate during the etch step of the process is greater the 4.0, (no wafer holder) please shutdown the system. From eenriquez at snf.stanford.edu Wed May 11 15:15:38 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 11 May 2011 15:15:38 -0700 Subject: Shutdown stsetch SNF 2011-05-11 09:38:12: High cooling He leak rate Message-ID: Found wafer chips underneath the wafer lifter which caused the lifter to stick up above the surface of the chuck. This resulted in the wafer not sitting flush on the lip seal. Leak rate is now OK. In the future, if the backside He flowrate during the etch step of the process is greater the 4.0, (no wafer holder) please shutdown the system. From eenriquez at snf.stanford.edu Wed May 11 16:33:38 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 11 May 2011 16:33:38 -0700 Subject: Problem stsetch SNF 2011-05-09 15:48:20: Etch PR fast Message-ID: Found wafer chips underneath the wafer lifter which caused the lifter to stick up above the surface of the chuck. This resulted in the wafer not sitting flush on the lip seal. Leak rate is now OK. In the future, if the backside He flowrate during the etch step of the process is greater the 4.0, (no wafer holder) please shutdown the system. From latta at snf.stanford.edu Wed May 11 16:37:38 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 11 May 2011 16:37:38 -0700 Subject: Comment stsetch SNF 2011-05-11 16:37:38: Qual after repairs (May) Message-ID: DEEP 00:10:00 1 Si ER = 1.63um/min, PR ER = 186A, Sel Si : PR = 88 : 1 Note: the Si etch rate is lower than expected ~2.um/min) From latta at snf.stanford.edu Wed May 11 16:37:51 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Wed, 11 May 2011 16:37:51 -0700 Subject: Comment stsetch SNF 2011-04-01 16:04:47: April quick check qual Message-ID: archived From eenriquez at snf.stanford.edu Thu May 12 08:12:33 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 12 May 2011 08:12:33 -0700 Subject: Comment stsetch SNF 2011-05-12 08:12:33: Updated process qual charts Message-ID: From latta at snf.stanford.edu Thu May 12 15:38:36 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 12 May 2011 15:38:36 -0700 Subject: Comment stsetch SNF 2011-05-12 15:38:35: 2nd Qual after repairs Message-ID: DEEP 00:10:00 Si ER = 1.60um/min, PR ER = 204A, Sel Si : PR = 78 : 1 Note: the Si etch rate is still lower than expected ~2.um/min) From jcdoll at snf.stanford.edu Sun May 15 14:00:12 2011 From: jcdoll at snf.stanford.edu (jcdoll at snf.stanford.edu) Date: Sun, 15 May 2011 14:00:12 -0700 Subject: Comment stsetch SNF 2011-05-15 14:00:11: pieces in chamber Message-ID: a couple of pieces broke off of my wafer during unloading. the pieces are large (>1cm) and all fell clear of the loader (i was using the wafer holder). the He leak rate is unchanged (3.8 w/ holder) and the pieces don't seem to be affecting anything. From latta at snf.stanford.edu Tue May 24 15:27:55 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Tue, 24 May 2011 15:27:55 -0700 Subject: Problem stsetch SNF 2011-05-24 15:27:55: System will not process Message-ID: Wafer loaded, but when process is selected will not go past 'standby' step'. I did notice that while this is occurring the loadlock pressure shows very low, lik 7.5mT. It is usually about 84mT. It rises slowly. Perhaps a leak between the LL and chamber? From eenriquez at snf.stanford.edu Wed May 25 09:54:11 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 25 May 2011 09:54:11 -0700 Subject: Problem stsetch SNF 2011-05-24 15:27:55: System will not process Message-ID: Communication problem with the process module. Reset the system. From latta at snf.stanford.edu Thu May 26 12:07:08 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 12:07:08 -0700 Subject: Comment stsetch SNF 2011-05-26 12:07:08: He flow getting to 3.9 Message-ID: From latta at snf.stanford.edu Thu May 26 16:13:05 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:13:05 -0700 Subject: Comment stsetch SNF 2011-04-04 09:33:18: Updated qualification charts Message-ID: archived From latta at snf.stanford.edu Thu May 26 16:13:26 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:13:26 -0700 Subject: Comment stsetch SNF 2011-04-12 10:17:29: Completed monthly PM Message-ID: archived From latta at snf.stanford.edu Thu May 26 16:14:01 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:14:01 -0700 Subject: Comment stsetch SNF 2011-05-11 16:37:38: Qual after repairs (May) Message-ID: Newer qual posted From latta at snf.stanford.edu Thu May 26 16:14:12 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:14:12 -0700 Subject: Comment stsetch SNF 2011-05-12 08:12:33: Updated process qual charts Message-ID: achived From latta at snf.stanford.edu Thu May 26 16:14:27 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:14:27 -0700 Subject: Comment stsetch SNF 2011-05-12 15:38:35: 2nd Qual after repairs Message-ID: newer qual posted From latta at snf.stanford.edu Thu May 26 16:14:57 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:14:57 -0700 Subject: Comment stsetch SNF 2011-05-15 14:00:11: pieces in chamber Message-ID: archived From latta at snf.stanford.edu Thu May 26 16:17:04 2011 From: latta at snf.stanford.edu (latta at snf.stanford.edu) Date: Thu, 26 May 2011 16:17:04 -0700 Subject: Comment stsetch SNF 2011-05-26 16:17:03: Another qual Message-ID: DEEP 00:10:00 Si ER = 2.10um/min, PR ER = 217A, Sel Si : PR = 97 : 1 ER's back to normal