The STS tool working OK
Jdas at activeoptical.com
Tue Jan 7 13:37:17 PST 2003
The DRIE tool worked OK for our ~45 um Deep etch process.
Using the recipe 'DEEP, we got about 2.1 um/min etch rates, compared to
about 2.4 um/min etch rate we got before the Holidays using the same
etch mask [15% exposed Si]. The process pressure roday is about 34 mt,
which is slightly lower than the usual ~38 mt for this recipe.
This pressure difference, associated with the slightly lower etch rate
may be due to the cleanlyness of the reactor and vacuum fittings.
Happy processing & Happy New Year.
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