etching through wafer
Andrew Arthur Davenport
adaven at stanford.edu
Thu Apr 8 03:55:32 PDT 2004
I'm trying to etch a 8um hole through a 325um wafer. I've tried the
standard recipies (deep and fastdeep), and also 7um and 10um resist. None
of these seem to be able to etch through within 4 hours (by that time the
resist is burnt). Have tried bonding to another wafer with photoresist - it
improves the resist lifetime but will still burn eventually. Just wondering
if anyone had experience with small deep features (or aspect ratios >30).
I'm currently trying one of the recipies in the Ayon paper listed on the SNF
website, but am uncertain of whether it will work.
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