From colby.bellew at sri.com Mon May 2 14:51:19 2005 From: colby.bellew at sri.com (Colby Bellew) Date: Mon, 02 May 2005 14:51:19 -0700 Subject: stsetch res removed Tuesday 13:30-14:30 Message-ID: <4276A0D7.4060108@sri.com> From fumin at stanford.edu Mon May 2 21:20:04 2005 From: fumin at stanford.edu (Fu-Min Wang) Date: Mon, 2 May 2005 21:20:04 -0700 Subject: 21:30-24:00 available tonight Message-ID: <005901c54f97$61c89b00$1aa540ab@mozart> I cannot use the time tonight. Sorry for the short notice. -------------- next part -------------- An HTML attachment was scrubbed... URL: From cheng1 at stanford.edu Thu May 5 10:48:12 2005 From: cheng1 at stanford.edu (Ching-Hsiang Cheng) Date: Thu, 5 May 2005 10:48:12 -0700 Subject: Reservation Removed from 5:30pm to 12am Today Message-ID: <1115315292.427a5c5c8c0bc@webmail.stanford.edu> Dear stsetch users, I have removed my reservation from 5:30pm to 12am today because wafers are not ready. Sorry for the short notice. Ching-Hsiang From bongsang at stanford.edu Sat May 7 08:31:38 2005 From: bongsang at stanford.edu (Bongsang Kim) Date: Sat, 7 May 2005 08:31:38 -0700 Subject: sts free - finished early Message-ID: <009801c55319$dc3f9750$0ab00c80@bongsang> An HTML attachment was scrubbed... URL: From barlian at stanford.edu Sat May 7 16:37:56 2005 From: barlian at stanford.edu (A. Alvin Barlian) Date: Sat, 7 May 2005 16:37:56 -0700 (PDT) Subject: reservation on Sat 5-7pm cancelled Message-ID: Sorry for the late notice, sts reservation on Sat 5-7 is cancelled. It was reserved under login name "me342e", however, me342e will not be using it. Thanks, Alvin (me342e) From izuleta at stanford.edu Sat May 7 21:33:03 2005 From: izuleta at stanford.edu (Ignacio A. Zuleta) Date: Sat, 7 May 2005 21:33:03 -0700 Subject: Anyone using STS right now? Message-ID: <200505080433.j484X4FS003239@smtp3.Stanford.EDU> -------------- next part -------------- An HTML attachment was scrubbed... URL: From colbybellew at yahoo.com Mon May 9 08:05:51 2005 From: colbybellew at yahoo.com (Colby Bellew) Date: Mon, 9 May 2005 08:05:51 -0700 (PDT) Subject: Removed Res stsetch Monday 10:00-13:00 Message-ID: <20050509150551.44061.qmail@web81405.mail.yahoo.com> My wafers are not ready so I've deleted the first part of my reservation on stsetch for today, Monday, 10:00-13:00. Sorry for the late notice. Colby From colbybellew at yahoo.com Mon May 9 10:10:18 2005 From: colbybellew at yahoo.com (Colby Bellew) Date: Mon, 9 May 2005 10:10:18 -0700 (PDT) Subject: Rem res stsetch Monday 13:00 - 14:00 Message-ID: <20050509171018.28102.qmail@web81406.mail.yahoo.com> From xzhuang at stanford.edu Tue May 10 10:24:18 2005 From: xzhuang at stanford.edu (Steve Zhuang) Date: Tue, 10 May 2005 10:24:18 -0700 Subject: STS etcher question References: <20050509171018.28102.qmail@web81406.mail.yahoo.com> Message-ID: <00f401c55585$18e8abc0$bb5640ab@pky7> Hi all, I have a question concerning overheating and resist burning in the STS etcher. I STS etched from the back side of a silicon wafer that was bonded to a quartz wafer using photoresist. The photoresist adhesive was uniform and baked property. However, during the 1 hour etching time, the photoresist mask on the silicon wafer was partially burned, and the adhesive photoresist between the silicon and quartz wafers became very non-uniform. I think this problem might have been caused by overheating during etching. Does anyone have similar experiences? Your input is highly appreciated! Thanks Steve Zhuang From mcvittie at snf.stanford.edu Wed May 11 12:03:52 2005 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Wed, 11 May 2005 12:03:52 -0700 Subject: STS etcher question References: <20050509171018.28102.qmail@web81406.mail.yahoo.com> <00f401c55585$18e8abc0$bb5640ab@pky7> Message-ID: <42825718.520A70F5@snf.stanford.edu> Jim, During plasma etching there is significant heat flow into the top surface of your wafer from the ion bombardment. The wafer temperature will rise until there is a balance between the heat flow into the top and out the bottom. If the wafer temperature goes too high ( about 110C range) the resist can flow and/or burn. To improve heat flow out the bottom of the wafer, the space between the wafer and cooled chuck is fill with He gas at a pressure around 10 torr. The STS etcher is designed to have about a 50C temperature difference between the cooled chuck and the wafer. When you mount a wafer on a carrier wafer, you are increasing the thermal resistance between the top wafer and the chuck. If the resist is thin and there are no gas bubbles, the increase in thermal resistance is not too high and the resist does not burn. However, if mounting of the carrier wafer is not great and you have bubbles, you are going to have heating problems during a long etch. One approach to minimizing this problem is to use the IR camera and to make sure there are no gas bubbles between the wafers. Also have an experienced user show you the best procedure for the mounting. Jim Steve Zhuang wrote: > Hi all, > > I have a question concerning overheating and resist burning in the STS > etcher. I STS etched from the back side of a silicon wafer that was bonded > to a quartz wafer using photoresist. The photoresist adhesive was uniform > and baked property. However, during the 1 hour etching time, the photoresist > mask on the silicon wafer was partially burned, and the adhesive photoresist > between the silicon and quartz wafers became very non-uniform. I think this > problem might have been caused by overheating during etching. Does anyone > have similar experiences? Your input is highly appreciated! > > Thanks > > Steve Zhuang -------------- next part -------------- A non-text attachment was scrubbed... Name: mcvittie.vcf Type: text/x-vcard Size: 422 bytes Desc: Card for Jim McVittie URL: From angela.mcconnell at stanford.edu Wed May 11 13:32:37 2005 From: angela.mcconnell at stanford.edu (Angie McConnell) Date: Wed, 11 May 2005 13:32:37 -0700 Subject: STS etcher question In-Reply-To: <42825718.520A70F5@snf.stanford.edu> References: <20050509171018.28102.qmail@web81406.mail.yahoo.com> <00f401c55585$18e8abc0$bb5640ab@pky7> <42825718.520A70F5@snf.stanford.edu> Message-ID: <6.0.1.1.2.20050511132528.0307a1d0@adm11.pobox.stanford.edu> An additional problem is that the silicon process wafer is bonded to a quartz wafer. This further increases the thermal resistance between the process wafer and the chuck since the thermal conductivity of quartz is at least one order of magnitude smaller than that of silicon. Is there a particular reason you need to use quartz? I have used silicon backing wafers glued on with photoresist dozens of times without photoresist burning problems. Angie McConnell At 12:03 PM 5/11/05, Jim McVittie wrote: >Jim, > >During plasma etching there is significant heat flow into the top surface of >your wafer from the ion bombardment. The wafer temperature will rise until >there >is a balance between the heat flow into the top and out the bottom. If the >wafer >temperature goes too high ( about 110C range) the resist can flow and/or burn. >To improve heat flow out the bottom of the wafer, the space between the wafer >and cooled chuck is fill with He gas at a pressure around 10 torr. The STS >etcher is designed to have about a 50C temperature difference between the >cooled >chuck and the wafer. When you mount a wafer on a carrier wafer, you are >increasing the thermal resistance between the top wafer and the chuck. If the >resist is thin and there are no gas bubbles, the increase in thermal >resistance >is not too high and the resist does not burn. However, if mounting of the >carrier wafer is not great and you have bubbles, you are going to have heating >problems during a long etch. One approach to minimizing this problem is to use >the IR camera and to make sure there are no gas bubbles between the wafers. >Also have an experienced user show you the best procedure for the mounting. > > Jim > >Steve Zhuang wrote: > > > Hi all, > > > > I have a question concerning overheating and resist burning in the STS > > etcher. I STS etched from the back side of a silicon wafer that was bonded > > to a quartz wafer using photoresist. The photoresist adhesive was uniform > > and baked property. However, during the 1 hour etching time, the > photoresist > > mask on the silicon wafer was partially burned, and the adhesive > photoresist > > between the silicon and quartz wafers became very non-uniform. I think this > > problem might have been caused by overheating during etching. Does anyone > > have similar experiences? Your input is highly appreciated! > > > > Thanks > > > > Steve Zhuang From ifushman at stanford.edu Mon May 16 14:39:13 2005 From: ifushman at stanford.edu (Ilya Fushman) Date: Mon, 16 May 2005 14:39:13 -0700 Subject: sample not ready removed res Message-ID: <1116279553.428913016ebaf@webmail.stanford.edu> --------------------- Ilya Fushman 215 Swain Way Palo Alto CA 94304 (650) 804 1058 --------------------- From ifushman at stanford.edu Mon May 16 14:39:18 2005 From: ifushman at stanford.edu (Ilya Fushman) Date: Mon, 16 May 2005 14:39:18 -0700 Subject: sample not ready removed res Message-ID: <1116279558.4289130671372@webmail.stanford.edu> --------------------- Ilya Fushman 215 Swain Way Palo Alto CA 94304 (650) 804 1058 --------------------- From cheng1 at stanford.edu Mon May 16 15:29:56 2005 From: cheng1 at stanford.edu (Ching-Hsiang Cheng) Date: Mon, 16 May 2005 15:29:56 -0700 Subject: sample not ready removed res In-Reply-To: <1116279553.428913016ebaf@webmail.stanford.edu> References: <1116279553.428913016ebaf@webmail.stanford.edu> Message-ID: <1116282596.42891ee4b371a@webmail.stanford.edu> I would like to claim this time slot. Thanks. Quoting Ilya Fushman : > > > --------------------- > Ilya Fushman > 215 Swain Way > Palo Alto CA 94304 > (650) 804 1058 > --------------------- > From bwchui at yahoo.com Tue May 17 11:47:49 2005 From: bwchui at yahoo.com (Benjamin Chui) Date: Tue, 17 May 2005 11:47:49 -0700 (PDT) Subject: STS available today 1700-1930 (tues) Message-ID: <20050517184754.43653.qmail@web40610.mail.yahoo.com> STS available today 1700-1930 (tues) Ben From ifushman at stanford.edu Wed May 18 18:26:22 2005 From: ifushman at stanford.edu (Ilya Fushman) Date: Wed, 18 May 2005 18:26:22 -0700 Subject: sts free Message-ID: <006601c55c11$c4a8bf80$555540ab@BEHEMOTH> done early, -ilya -------------- next part -------------- An HTML attachment was scrubbed... URL: From ginel at stanford.edu Sun May 22 14:17:48 2005 From: ginel at stanford.edu (Ginel Hill) Date: Sun, 22 May 2005 14:17:48 -0700 (PDT) Subject: sts free until 4pm today Message-ID: done early From bwchui at yahoo.com Wed May 25 19:14:00 2005 From: bwchui at yahoo.com (Benjamin Chui) Date: Wed, 25 May 2005 19:14:00 -0700 (PDT) Subject: STS available tonight 1930-2200 Message-ID: <20050526021401.46748.qmail@web40609.mail.yahoo.com> My first wafer didn't work out well so I decided not to go ahead with the rest. (Nothing wrong with the machine.) Ben From hra at stanford.edu Fri May 27 11:50:11 2005 From: hra at stanford.edu (Hye Jun Ra) Date: Fri, 27 May 2005 11:50:11 -0700 Subject: reservation cancelled for 1:30-5:30pm. Message-ID: <1117219811.42976be30a1fb@webmail.stanford.edu> samples are not ready. sorry for the late notice.