From xzhuang at stanford.edu Wed Oct 12 11:42:11 2005 From: xzhuang at stanford.edu (Steve Zhuang) Date: Wed, 12 Oct 2005 11:42:11 -0700 Subject: question on STSETCH recipe to minimize trench widening References: <20050901205935.69120.qmail@web31503.mail.mud.yahoo.com> Message-ID: <003d01c5cf5c$a8543940$bb5640ab@pky7> Dear STSETCH users, I have a question regarding the recipe to use for etching straight trenches. I am trying to etch 10 um wide trenches on a 120 um thick silicon substrate. The etching will be terminated by an oxide layer. I used the standard "deep" recipe and had a problem with the trench widening during etching. At 100um deep, the trenches are widened by about 5um. It is especially bad at the end of the trench where sideway etching is very pronounced (trenches are widened by more than 10 um). For my process, it is critical that the trenches remain <15um wide. I understand the sideway etching at the silicon/oxide interface is partly due to over etching. But how about the widening during the etching? Is that another recipe that mitigates this problem? Any input will be highly appreciated! Thanks. Steve Zhuang From colby.bellew at sri.com Wed Oct 12 11:50:17 2005 From: colby.bellew at sri.com (Colby Bellew) Date: Wed, 12 Oct 2005 11:50:17 -0700 Subject: stsetch res rem today 15:00-17:00 Message-ID: <434D5AE9.8060206@sri.com> I shifted my reservation to tomorrow morning on stsetch. -- ********************************* Colby Bellew, PhD Research Engineer - MEMS SRI International Menlo Park, CA 94025 650-859-2647 (Phone) 650-859-3090 (fax) ********************************* From ben.jian at arrayedfiberoptics.com Sun Oct 16 12:42:59 2005 From: ben.jian at arrayedfiberoptics.com (=?iso-8859-1?Q?ben.jian?=) Date: Sun, 16 Oct 2005 19:42:59 +0000 Subject: Machine available from 2PM to 7PM today Message-ID: <20051016194259.7349.qmail@server266.com> Sorry for the late notice. -------------- next part -------------- An HTML attachment was scrubbed... URL: From elvislin at stanford.edu Thu Oct 20 15:23:21 2005 From: elvislin at stanford.edu (Elvis Der-Song Lin) Date: Thu, 20 Oct 2005 15:23:21 -0700 Subject: PLEASE PLEASE help with STS etcher footing problem Message-ID: <200510202223.j9KMNNXn018402@smtp1.Stanford.EDU> Hi my knowledgeable and experienced friends, My groupmember and I have a question regarding methods to minimize the footing problem when using the STS ether to etch trenches with oxide as etch stop. I used the "deep" recipe to etch 120 um deep trenches which are 10 um wide. I did about 5 minutes of over etching. After etching, the footing was very severe, especially at places where two trenches cross etch other. The footing was at least 5 um on each side. Is there a recipe that is tuned to miniminze the "footing" problem? Any suggestions will be high appreciated! -Elvis -------------- next part -------------- An HTML attachment was scrubbed... URL: From amf at amfitzgerald.com Thu Oct 20 18:52:03 2005 From: amf at amfitzgerald.com (Alissa M. Fitzgerald) Date: Thu, 20 Oct 2005 18:52:03 -0700 Subject: PLEASE PLEASE help with STS etcher footing problem In-Reply-To: <200510202223.j9KMNNXn018402@smtp1.Stanford.EDU> Message-ID: I'd look into using stsetch2 (talk to Ed Myers - it isn't quite released yet, but maybe you could be among the first to get on it). The footing problem/stopping on oxide has been solved on the newer generations of DRIE tools. Don't waste your time trying to make pigs fly. -Alissa _____ From: Elvis Der-Song Lin [mailto:elvislin at stanford.edu] Sent: Thursday, October 20, 2005 3:23 PM To: stsetch at snf.stanford.edu; p5000etch at snf.stanford.edu Subject: PLEASE PLEASE help with STS etcher footing problem Hi my knowledgeable and experienced friends, My groupmember and I have a question regarding methods to minimize the footing problem when using the STS ether to etch trenches with oxide as etch stop. I used the "deep" recipe to etch 120 um deep trenches which are 10 um wide. I did about 5 minutes of over etching. After etching, the footing was very severe, especially at places where two trenches cross etch other. The footing was at least 5 um on each side. Is there a recipe that is tuned to miniminze the "footing" problem? Any suggestions will be high appreciated! -Elvis -------------- next part -------------- An HTML attachment was scrubbed... URL: From aeonia at stanford.edu Fri Oct 21 21:30:21 2005 From: aeonia at stanford.edu (Hyeun-su Kim) Date: Fri, 21 Oct 2005 21:30:21 -0700 Subject: Black rubber ring is missing. Message-ID: <1129955421.4359c05da1aa3@webmail> Dear stsetch users, I found there is no black rubber ring in the metal support frame. Does anybody know if we have an extra? Thanks. Hyeun-su (aeonia)