From jprovine at stanford.edu  Sat Jun 16 11:26:41 2007
From: jprovine at stanford.edu (J Provine)
Date: Sat, 16 Jun 2007 11:26:41 -0700
Subject: stsetch free noon-4pm saturday 6.16
Message-ID: <20070616112641.c2l88ivlfwiswc4g@webmail.stanford.edu>

sorry for the late notice.  i sent a mail last night, but to the wrong  
address.

~j
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From: J Provine <jprovine at stanford.edu>
Subject: stsetch free noon-4pm saturday 6.16
Date: Fri, 15 Jun 2007 22:24:28 -0700
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From okilic at stanford.edu  Tue Jun 19 16:18:31 2007
From: okilic at stanford.edu (Onur Kilic)
Date: Tue, 19 Jun 2007 16:18:31 -0700
Subject: sts 16:00-20:00 free now
Message-ID: <2f2f0d6f0706191618h6c0c0a67g328d375025de8e70@mail.gmail.com>

Sorry for last minute notice. I realized a problem with my wafers, they need
further processing. My spot is released on coral.

Onur
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From eap at gloworm.Stanford.EDU  Sat Jun 23 18:38:36 2007
From: eap at gloworm.Stanford.EDU (Eric Perozziello)
Date: Sat, 23 Jun 2007 18:38:36 -0700 (PDT)
Subject: STSetch back alive, and not breaking wafers
Message-ID: <Pine.GSO.4.44.0706231822150.19101-100000@gloworm.Stanford.EDU>


Hi All,

As you might know, the stsetch was effectively "down"
for a repeated wafer-breaking problem.

I think that problem is resolved now, as I executed
dozens of transfers last night on a dummy wafer with no
breaking/chipping.  I cleared the broken wafer, and I think
identified the root cause.

The machine was down all day today because I couldn't get it
to pump down.  I finally managed to get past that
problem, and measured the leakrate at <0.25 millitorr
per minute, which is by far the lowest I've ever seen it.  (Mainly
because I first thought the pumpdown might be a leak
caused by the chamber service, so I went through the whole
chamber to make better seals).

In going through the chamber in detail, I did notice is that
seals inside are getting
eaten fast, probably due to excessively long O2 cleans.
We should probably limit these cleans to ~20 minutes in a
given day of etching.

Also, the screw caps are pretty much completely gone (again,
due to a lot of "cleaning"), and we have no replacements in
stock.  We need to order more, but in the meantime, I don't
expect the wafers coming out to be "iron free".

So, I believe the machine is ok to use now.  It's still
listed as a "problem" from Ed, but I believe that is now
completely resolved.  The only (minor) issue that I noticed
is that the loader is loading the wafer a little "deep"
into the chamber.  Keep an eye on the position.

Happy Etching.
-Eric




From cbax at stanford.edu  Mon Jun 25 15:47:11 2007
From: cbax at stanford.edu (cbax at stanford.edu)
Date: Mon, 25 Jun 2007 15:47:11 -0700
Subject: Dry Pump
Message-ID: <20070625154711.mgfvobawc3280og4@webmail.stanford.edu>


  To All Users,

  The backing pump for the turbo pump is bad, it only
  pump down just below 200mt. The pump is been removed
  and will send out for repair asap. Estimated time to
  repair the bad dry pump is 4 to 5 days.

  Thanks,
  Cesar