New Stand-By Procedure

Nahid Harjee nharjee at stanford.edu
Fri Apr 16 16:57:48 PDT 2010


stsetch users,

A reminder about the policy below. Make sure when you leave the tool, the
load lock is under vacuum. Over the past month, every time I've come to the
tool, the load lock was vented.

nh

On Fri, Aug 15, 2008 at 11:54 AM, Nancy Latta <nlatta at stanford.edu> wrote:

> Dear STS Etchers,
>
> The recent problems with the chamber isolation valve leak has given us to
> opportunity to review our standard operating procedure with regard to the
> stand-by or idle mode.  In the past we have left the loadlock vented.
>
> From now on users of the tool should leave the loadlock under vacuum after
> completing their runs.  This will help in decreasing wear and tear on the
> turbo pump.  It also is consistent with the procedures at stsetch2.
>
> In order to leave the loadlock under vacuum after your work is completed
>  you will need to load  a 'fake' or 'phantom' wafer.  You simply  click on
> the LOAD button.  The software will falsely indicate a wafer is on the
> chuck.
>
> When you approach the etcher to begin etching you will need to UNLOAD this
> fake wafer and VENT the loadlock.
>
> This message will be posted in the coral comments for stsetch and new
> operating instructions will be placed into the logbook.  Unfortunately, the
> website will continue to show the old operating instructions.  I have
> attached a copy of the new instructions to this message.
>
> Please let us know if you have any comments or questions. And thanks for
> your attention.
>
> Team Etch
>



-- 
Nahid Harjee
Ph.D. Candidate
Electrical Engineering
Stanford University
408-761-8651
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