New Stand-By Procedure

Eric Perozziello eap at gloworm.Stanford.EDU
Fri Apr 16 21:12:43 PDT 2010


There's no reason to do this any more.

This was a temporary measure I suggested
when the entrance valve was leaking....
It's since been fixed for over a year.

-Eric


On Fri, 16 Apr 2010, Nahid Harjee wrote:

> stsetch users,
>
> A reminder about the policy below. Make sure when you leave the tool, the
> load lock is under vacuum. Over the past month, every time I've come to the
> tool, the load lock was vented.
>
> nh
>
> On Fri, Aug 15, 2008 at 11:54 AM, Nancy Latta <nlatta at stanford.edu> wrote:
>
> > Dear STS Etchers,
> >
> > The recent problems with the chamber isolation valve leak has given us to
> > opportunity to review our standard operating procedure with regard to the
> > stand-by or idle mode.  In the past we have left the loadlock vented.
> >
> > From now on users of the tool should leave the loadlock under vacuum after
> > completing their runs.  This will help in decreasing wear and tear on the
> > turbo pump.  It also is consistent with the procedures at stsetch2.
> >
> > In order to leave the loadlock under vacuum after your work is completed
> >  you will need to load  a 'fake' or 'phantom' wafer.  You simply  click on
> > the LOAD button.  The software will falsely indicate a wafer is on the
> > chuck.
> >
> > When you approach the etcher to begin etching you will need to UNLOAD this
> > fake wafer and VENT the loadlock.
> >
> > This message will be posted in the coral comments for stsetch and new
> > operating instructions will be placed into the logbook.  Unfortunately, the
> > website will continue to show the old operating instructions.  I have
> > attached a copy of the new instructions to this message.
> >
> > Please let us know if you have any comments or questions. And thanks for
> > your attention.
> >
> > Team Etch
> >
>
>
>
> --
> Nahid Harjee
> Ph.D. Candidate
> Electrical Engineering
> Stanford University
> 408-761-8651
>




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