From shott at stanford.edu Tue Jun 1 17:23:11 2010 From: shott at stanford.edu (John Shott) Date: Tue, 01 Jun 2010 17:23:11 -0700 Subject: Tool free tomorrow morning .... Message-ID: <4C05A46F.8030209@stanford.edu> STSetch Community: Because we expect that STS Field Service will be working on stsetch2 tomorrow morning, we have released our reservation on stsetch for the morning. We expect, however, to begin addressing the helium backside cooling issues on this tool in the afternoon. We will try to keep you apprised of when we will be working on each tool, but ask that you try to accommodate Frank Monano's access to these two tools so that we can resolve as many problems as possible during this visit. Thank you for your continued support, John From eap at gloworm.Stanford.EDU Tue Jun 1 21:08:21 2010 From: eap at gloworm.Stanford.EDU (Eric Perozziello) Date: Tue, 1 Jun 2010 21:08:21 -0700 (PDT) Subject: STSetch free at 9PM Message-ID: Sorry for the late notice- wafers did not arrive.... -Eric From jwpchen at stanford.edu Tue Jun 8 23:35:15 2010 From: jwpchen at stanford.edu (Peter Chen) Date: Tue, 08 Jun 2010 23:35:15 -0700 Subject: reservation released Wed 8pm-12am Message-ID: <4C0F3623.50202@stanford.edu> waiting until helium is really fixed From shott at stanford.edu Wed Jun 9 14:33:46 2010 From: shott at stanford.edu (John Shott) Date: Wed, 09 Jun 2010 14:33:46 -0700 Subject: Pressure controller update .... Message-ID: <4C1008BA.6020902@stanford.edu> STSetch community: We believe that we have finally resolved the leakage issues that resulted in the inability to maintain the backside helium pressure at 10 Torr. Elmer and Frank Montano of STS spent a lot of time over the past few days going over that entire system. There are two main things that likely contributed to the problems that we observed: 1. There is a 7" ID O-ring seal at the outer edge of the platen/chuck assembly. The clamping force of that O-ring is supplied by three slotted screws that are well inside the lip seal in a ring of about 2" in diameter. Very minor differences in the tightening torque of these screws will result in significant variation on the clamping pressure of that O-ring around the circumference. If this O-ring is not sufficiently well compressed around the entire circumference, it will likely result in additional helium "blow by". 2. There are three little spring-loaded teflon "pips" inside the lip seal that apply upward pressure at three points on the wafer. One of these was applying significantly more upward force than the others and was likely tilting the wafer so that one side of the lip seal was not in contact with the wafer even with the clamping force of the eight fingers. Replacing the springs with "factory fresh" STS springs did not reliably resolve the issue. At the moment, while we are awaiting the arrival of a set of similar, but weaker, springs, we have been running successfully without the little teflon pips. According to STS, in fact, a number of their customers routinely run without these teflon pips ... particularly customers that are processing thin wafers. We will be evaluating performance without these pieces to see whether we may also be better off without them ... or whether weaker springs helps them. Yesterday afternoon, Nancy ran a post-field-service qualification and noted the following: > I ran a qual after the field service repairs. This is run without the > spring loaded pips; > Si ER = 2.02um/min > PR ER = 212A/min > Sel Si : PR = 95.3 : 1 > So, improvement from last qual (Si ER = 1.71) but still not up to the > normal 2.5-2.7um/min for Si. > Observations during the qual; He pressure stable, He flow oscillates > from 2.3 to 2.9 and back, SF6 flow overshoots the requested 130sccm to > about 144sccm then decreases to about 118sccm. Never really stable at > 130sccm. As you can see, the silicon etch rate is still a bit low ... although not as low as it was a week or so ago. We will work to identify and resolve that, but expect that a number of folks will want to use the system now that the helium backside cooling issues have been resolved. Note: for those of you using the aluminum wafer carrier, we would appreciate knowing that helium flow readings you observe during that use. This tool is now back in service and we are confident that it will quickly be in heavy used to eliminate a backlog of demand. Let us know if you have any questions, John From jwpchen at stanford.edu Sat Jun 12 18:10:35 2010 From: jwpchen at stanford.edu (Peter Chen) Date: Sat, 12 Jun 2010 18:10:35 -0700 Subject: stsetch reservation released tonight 8pm-midnight Message-ID: <4C14300B.3090703@stanford.edu> wafers not ready due to asml down From mt.innovate at gmail.com Sun Jun 20 04:15:02 2010 From: mt.innovate at gmail.com (Mike Tan) Date: Sun, 20 Jun 2010 04:15:02 -0700 Subject: reservation released 7:30-11:00 tomorrow Sunday Message-ID: From cfchiang at stanford.edu Tue Jun 22 20:36:58 2010 From: cfchiang at stanford.edu (Chia-Fang Chiang) Date: Tue, 22 Jun 2010 20:36:58 -0700 (PDT) Subject: stsetch reservation released - tomorrow 4:30-8pm Message-ID: <1654151924.64999.1277264218855.JavaMail.root@zm06.stanford.edu> Sample won't be ready.