From eenriquez at snf.stanford.edu Tue Jan 6 08:49:30 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 6 Jan 2009 08:49:30 -0800 Subject: Shutdown stsetch2 SNF 2008-11-05 18:58:29: Down for Wafer mapping Message-ID: Vendor replaced two boards and a cable. Cycled many wafers with no problems. From eenriquez at snf.stanford.edu Tue Jan 6 08:55:00 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 6 Jan 2009 08:55:00 -0800 Subject: Comment stsetch2 SNF 2008-12-03 16:49:45: Update Message-ID: Archived From eenriquez at snf.stanford.edu Tue Jan 6 08:55:08 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 6 Jan 2009 08:55:08 -0800 Subject: Comment stsetch2 SNF 2008-12-09 13:01:41: Update Message-ID: Archived From peichen at snf.stanford.edu Sun Jan 11 00:38:21 2009 From: peichen at snf.stanford.edu (peichen at snf.stanford.edu) Date: Sun, 11 Jan 2009 00:38:21 -0800 Subject: Problem stsetch2 SNF 2009-01-11 00:38:21: Chamber transfer gate did not open Message-ID: The chanber transfer gate did not open during wafer transfer. Alarm kept showing time out error. Wafer coudn't never get into the chamber for etching. From wpeng at snf.stanford.edu Mon Jan 12 13:16:21 2009 From: wpeng at snf.stanford.edu (wpeng at snf.stanford.edu) Date: Mon, 12 Jan 2009 13:16:21 -0800 Subject: Problem stsetch2 SNF 2009-01-12 13:16:21: wafer inside chamber Message-ID: process stop due to loss of backside He pressure From eenriquez at snf.stanford.edu Mon Jan 12 15:13:26 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 12 Jan 2009 15:13:26 -0800 Subject: Problem stsetch2 SNF 2009-01-12 13:16:21: wafer inside chamber Message-ID: Recovered the user's wafer. The user etched the wafer too deeply and it blew out. Cleaned the chamber, replaced the lip seal. Did not have a chance to run an O2 plasma because the temperature was too low. From eenriquez at snf.stanford.edu Mon Jan 12 15:14:25 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 12 Jan 2009 15:14:25 -0800 Subject: Problem stsetch2 SNF 2009-01-11 00:38:21: Chamber transfer gate did not open Message-ID: Air line to the gate valve popped off. Cut a section of the line and reinstalled. From eenriquez at snf.stanford.edu Mon Jan 12 15:15:18 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 12 Jan 2009 15:15:18 -0800 Subject: Comment stsetch2 SNF 2009-01-12 15:15:17: Need to run O2 clean Message-ID: Please run a Maintenance O2 clean before processing your device. From eenriquez at snf.stanford.edu Tue Jan 13 10:28:23 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 13 Jan 2009 10:28:23 -0800 Subject: Comment stsetch2 SNF 2009-01-12 15:15:17: Need to run O2 clean Message-ID: Ran 30 min O2 clean From rostam at snf.stanford.edu Mon Jan 26 16:00:36 2009 From: rostam at snf.stanford.edu (rostam at snf.stanford.edu) Date: Mon, 26 Jan 2009 16:00:36 -0800 Subject: Problem stsetch2 SNF 2009-01-26 16:00:35: APC position error Message-ID: APC position rose above the alarm level specified in the tolerance recipe. the setpoint was 15, the value reached was 51.7 From rostam at snf.stanford.edu Mon Jan 26 17:43:30 2009 From: rostam at snf.stanford.edu (rostam at snf.stanford.edu) Date: Mon, 26 Jan 2009 17:43:30 -0800 Subject: Comment stsetch2 SNF 2009-01-26 17:43:29: APC error (cont) Message-ID: The APC error just occured for thinner wafers (300 um thick). It didn't occur for regular B-test wafers 500um thick. Everything was fine for B-test wafers. From eenriquez at snf.stanford.edu Wed Jan 28 09:03:32 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 28 Jan 2009 09:03:32 -0800 Subject: Problem stsetch2 SNF 2009-01-26 16:00:35: APC position error Message-ID: Ran 2 wafers with no problems. From eenriquez at snf.stanford.edu Wed Jan 28 09:03:39 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 28 Jan 2009 09:03:39 -0800 Subject: Comment stsetch2 SNF 2009-01-26 17:43:29: APC error (cont) Message-ID: Ran 2 wafers with no problems. From wessmith at snf.stanford.edu Wed Jan 28 13:04:27 2009 From: wessmith at snf.stanford.edu (wessmith at snf.stanford.edu) Date: Wed, 28 Jan 2009 13:04:27 -0800 Subject: Problem stsetch2 SNF 2009-01-28 13:04:27: Leak Test Failure Message-ID: Leak test alarmed on several wafers (>16mTorr/min) and eventaully failed several times in a row (>25mTorr/min). From emyers at snf.stanford.edu Wed Jan 28 15:29:59 2009 From: emyers at snf.stanford.edu (emyers at snf.stanford.edu) Date: Wed, 28 Jan 2009 15:29:59 -0800 Subject: Problem stsetch2 SNF 2009-01-28 13:04:27: Leak Test Failure Message-ID: The first 7um resist wafer I tried failed a couple of times. Ran a bare Si with no problem. I did a little cleaning of a 7um resist wafer and it is running. It seems like the problem for my wafers came from resist at the very edge of the wafer. From mislam at snf.stanford.edu Thu Jan 29 21:17:14 2009 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Thu, 29 Jan 2009 21:17:14 -0800 Subject: Problem stsetch2 SNF 2009-01-29 21:17:13: Leak rate failing Message-ID: Showing consistantly high He leak rate for last two weeks. Most of the time it shows 16-18, other times above 25 and fails. Used to seeing 8-10mTorr/ min. From eenriquez at snf.stanford.edu Fri Jan 30 08:33:15 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 30 Jan 2009 08:33:15 -0800 Subject: Problem stsetch2 SNF 2009-01-29 21:17:13: Leak rate failing Message-ID: Replaced the He lip seal and 3 teflon screw caps. Ran an O2 plasma with a He leak rate of 5.36 mT/min