From eenriquez at snf.stanford.edu Tue Nov 3 15:42:09 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 3 Nov 2009 15:42:09 -0800 Subject: Shutdown stsetch2 SNF 2009-11-03 15:42:09: Low coolant flow Message-ID: Reinstalled repaired chiller but the flow rate is not enough to satisfy the flow switch. Need to troubleshoot . Will reinstall the backup chiller if unable to make the repaired chiller work. From mcvittie at snf.stanford.edu Tue Nov 3 18:12:53 2009 From: mcvittie at snf.stanford.edu (mcvittie at snf.stanford.edu) Date: Tue, 3 Nov 2009 18:12:53 -0800 Subject: Shutdown stsetch2 SNF 2009-11-03 15:42:09: Low coolant flow Message-ID: Valve chiller was not opened all the way. Jim From eenriquez at snf.stanford.edu Wed Nov 4 16:11:43 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 4 Nov 2009 16:11:43 -0800 Subject: Comment stsetch2 SNF 2009-10-30 10:07:33: Update water flow switch Message-ID: Archived From eenriquez at snf.stanford.edu Wed Nov 4 16:21:36 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 4 Nov 2009 16:21:36 -0800 Subject: Comment stsetch2 SNF 2009-11-04 16:21:33: Update coil chiller Message-ID: Coil chiller now is under system control. From mcvittie at snf.stanford.edu Mon Nov 9 20:45:01 2009 From: mcvittie at snf.stanford.edu (Jim McVittie) Date: Mon, 09 Nov 2009 20:45:01 -0800 Subject: STS2: Funnel Installation Message-ID: <4AF8EFCD.1000902@snf.stanford.edu> Hi, Over the last few months we have done a lot of work on STS2 to get it back to proper operation. Much of the work was done by Elmer. The whole inside of the chamber was cleaned, all the o-rings and seals where changed and problems with the cooling, heating and matching were all corrected. I think we have all the problems solved. After a lot of work by Rostam Dinyari on tuning his SOI etch process, we are seeing great etch results. Back in May, STS suggested that we would get better results if we added the so called funnel to our system. As I see it, there has been a chamber design problem with the STS2 went we purchased the tool. The tool was designed to maximize the transport of the plasma from the ICP zone to the wafer. Normally, one wants lots of ion bombardment at the wafer to enhance etching in a plasma etch tool. However, the Bosch process, which relies on F chemical etching of the silicon, does not need such a high ion flux. In fact, the high ion flux is a problem in that it causes resist etching, which lower resist selectivity. The original tool design tried to overcome this problem by adding the electromagnet to enhance electron loss to the chamber walls. Since ions have to follow the electron, the ions loss was also enhanced. This solution was not enough since we have users complaining about low selectivity on STS2 compared to STS1. To correct the problem STS has added a can with open ends or what they call a funnel between the ICP zone and the wafer. As I understand the funnel, it adds an electron/ion recombination surface, which attenuates the plasma and thus lowers the ion flux to the wafer. Although one might expect reactive radicals to also be lost by recombination on this surface, STS says that the etch rate will go up indicating that the funnel is actually directing more of the radicals to the wafer than without the funnel. The Bosch process relies on a delicate flux balance of ions and radicals. I expect the funnel will alter this balance so all the processes will have to adjusted or tuned after the addition of the funnel. Hopefully, the adjustment will be minor and all the processes will need the same type of adjustment. The plan is to install the funnel next Monday (Nov 16). I will do some characterization before and after the installation to get a sense of what has to be changed on the processes. Starting Tuesday, I will work Rostam to tune his SOI process. Once we have his process working with the funnel, I will let everyone know what results we are seeing. Hopefully, the funnel will meet expectations and we will not have to remove it. Thanks, Jim From mislam at snf.stanford.edu Thu Nov 12 22:33:49 2009 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Thu, 12 Nov 2009 22:33:49 -0800 Subject: Problem stsetch2 SNF 2009-11-12 22:33:48: Loadlock won't vent. Message-ID: From cbaxter at snf.stanford.edu Sun Nov 15 20:34:07 2009 From: cbaxter at snf.stanford.edu (cbaxter at snf.stanford.edu) Date: Sun, 15 Nov 2009 20:34:07 -0800 Subject: Problem stsetch2 SNF 2009-11-12 22:33:48: Loadlock won't vent. Message-ID: Vented load lock at automode w/out problem. From eenriquez at snf.stanford.edu Mon Nov 16 14:51:27 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 16 Nov 2009 14:51:27 -0800 Subject: Comment stsetch2 SNF 2009-11-04 16:21:33: Update coil chiller Message-ID: Archived From barlian at snf.stanford.edu Tue Nov 17 03:02:09 2009 From: barlian at snf.stanford.edu (barlian at snf.stanford.edu) Date: Tue, 17 Nov 2009 03:02:09 -0800 Subject: Problem stsetch2 SNF 2009-11-17 03:02:09: WAFER BROKEN Message-ID: part of my wafer was broken inside the process chamber From eenriquez at snf.stanford.edu Tue Nov 17 14:36:07 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 17 Nov 2009 14:36:07 -0800 Subject: Problem stsetch2 SNF 2009-11-17 03:02:09: WAFER BROKEN Message-ID: Removed broken wafer pieces and wiped down the chuck. Replace several worn out teflon screw caps on the clamp assembly. From eenriquez at snf.stanford.edu Thu Nov 19 11:06:27 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 19 Nov 2009 11:06:27 -0800 Subject: Shutdown stsetch2 SNF 2009-11-19 11:06:25: Chamber has been modified Message-ID: Installed the coil funnel. Jim needs to characterize the system before we can release it for general use. From mcvittie at snf.stanford.edu Fri Nov 20 18:45:13 2009 From: mcvittie at snf.stanford.edu (mcvittie at snf.stanford.edu) Date: Fri, 20 Nov 2009 18:45:13 -0800 Subject: Shutdown stsetch2 SNF 2009-11-19 11:06:25: Chamber has been modified Message-ID: The funnel has been installed and does modify process results. Please note I sent out to STS2 users. Jim From jsnapp at snf.stanford.edu Sun Nov 22 12:41:57 2009 From: jsnapp at snf.stanford.edu (jsnapp at snf.stanford.edu) Date: Sun, 22 Nov 2009 12:41:57 -0800 Subject: Problem stsetch2 SNF 2009-11-22 12:41:56: pneumatic hose lose? - wafer won't transfer Message-ID: Got alarm that wafer won't transfer from load-lock to process chamber. This was concurrent with very loud hissing (I am assuming from a lose/detached pneumatic line) which ended when transfer operation was aborted. From eenriquez at snf.stanford.edu Mon Nov 23 11:54:56 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 23 Nov 2009 11:54:56 -0800 Subject: Problem stsetch2 SNF 2009-11-22 12:41:56: pneumatic hose lose? - wafer won't transfer Message-ID: Repaired the broken pneumatic line. Recovered the users wafer and placed it in the container. Cycled wafers and ran an O2 plasma. From jsnapp at snf.stanford.edu Mon Nov 23 22:51:10 2009 From: jsnapp at snf.stanford.edu (jsnapp at snf.stanford.edu) Date: Mon, 23 Nov 2009 22:51:10 -0800 Subject: Problem stsetch2 SNF 2009-11-23 22:51:09: software froze Message-ID: software froze (mouse moves but nothing else) during map wafers step. wafer stuck in load-lock. From eenriquez at snf.stanford.edu Tue Nov 24 10:19:34 2009 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Tue, 24 Nov 2009 10:19:34 -0800 Subject: Problem stsetch2 SNF 2009-11-23 22:51:09: software froze Message-ID: Reset the software. Cycled a wafer and ran an O2 clean.