From eenriquez at snf.stanford.edu Wed Apr 6 14:23:55 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Wed, 6 Apr 2011 14:23:55 -0700 Subject: Comment stsetch2 SNF 2011-03-21 10:36:27: Pumped out O2 line Message-ID: Archived From eenriquez at snf.stanford.edu Thu Apr 7 15:06:02 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Thu, 7 Apr 2011 15:06:02 -0700 Subject: Comment stsetch2 SNF 2011-04-07 15:06:02: Update chuck temperature Message-ID: It appears that the indium gasket that transfers the heat from the the chuck to the cooled electrode is too thin. I measured the gap between the wafer chuck and the cooled electrode assembly. The gap = 0.65 mm (2) Indium gaskets combined thickness = 0.62 mm I will order another indium gasket. From jasmine at snf.stanford.edu Mon Apr 11 14:10:17 2011 From: jasmine at snf.stanford.edu (jasmine at snf.stanford.edu) Date: Mon, 11 Apr 2011 14:10:17 -0700 Subject: Problem stsetch2 SNF 2011-04-11 14:10:17: very leaky He flow Message-ID: From eenriquez at snf.stanford.edu Mon Apr 11 15:04:59 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Mon, 11 Apr 2011 15:04:59 -0700 Subject: Problem stsetch2 SNF 2011-04-11 14:10:17: very leaky He flow Message-ID: STSetch1 actually had the problem. Adjusted the He bypass flow. From karthikv at snf.stanford.edu Wed Apr 20 23:32:39 2011 From: karthikv at snf.stanford.edu (karthikv at snf.stanford.edu) Date: Wed, 20 Apr 2011 23:32:39 -0700 Subject: Shutdown stsetch2 SNF 2011-04-20 23:32:38: Roughing valve won't close Message-ID: Got a red alarm during processing for "gas flow software interlock". Tried to abort process and pump to base to retreive wafer. Another red alarm, "roughing valve won't close when asked to do so". Wafer stuck inside chamber. From eenriquez at snf.stanford.edu Fri Apr 22 14:13:42 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 22 Apr 2011 14:13:42 -0700 Subject: Shutdown stsetch2 SNF 2011-04-20 23:32:38: Roughing valve won't close Message-ID: Found the devicenet module #4 circuit breaker had tripped. The root cause was a loose wire in the roughing valve position switch. The wire shorted to ground which kicked off the breaker. The position switch was assembled from the factory with one missing screw. This cause the whole assembly to move whenever the valve is actuated. This movement caused the eventual breakage of the wire. From eenriquez at snf.stanford.edu Fri Apr 22 14:19:30 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 22 Apr 2011 14:19:30 -0700 Subject: Comment stsetch2 SNF 2011-04-22 14:19:28: Update chuck temperature Message-ID: The indium gasket is here. I want to run an etch rate test before(3 wafers) and after(3 wafers) I install the gasket. Now waiting for Mary or Jim Mc to run the before test. From karthikv at snf.stanford.edu Fri Apr 22 18:36:12 2011 From: karthikv at snf.stanford.edu (karthikv at snf.stanford.edu) Date: Fri, 22 Apr 2011 18:36:12 -0700 Subject: Problem stsetch2 SNF 2011-04-22 18:36:11: Same problems as before Message-ID: I ran a 10min O2 clean followed by From karthikv at snf.stanford.edu Fri Apr 22 18:41:30 2011 From: karthikv at snf.stanford.edu (karthikv at snf.stanford.edu) Date: Fri, 22 Apr 2011 18:41:30 -0700 Subject: Problem stsetch2 SNF 2011-04-22 18:41:29: Same problem as before Message-ID: I ran a 10min O2 clean followed by a 10min seasoning. Both went through without a problem. I then tried etching my device wafers and it failed to etch with the exact same alerts as before. I was able to pump to base and retrieve my wafer and tried a second time. This time the wafer failed leak test (30mtorr/min leak rate when limit is 25). I am currently processing another device wafer which seems to be etching fine so far (about 5mins into the etch) but the leak rate is still a bit on the higher side at 16 mtorr/min. The wafer that got stuck in the chamber 2 days ago has a circle of charred material on the backside. Acetone doesn't remove this material. From npapte at snf.stanford.edu Mon Apr 25 21:11:32 2011 From: npapte at snf.stanford.edu (npapte at snf.stanford.edu) Date: Mon, 25 Apr 2011 21:11:32 -0700 Subject: Problem stsetch2 SNF 2011-04-25 21:11:31: could not process wafers Message-ID: keep getting alarm "switched off 13.56MHz coil as Generator Software Interlock Chain became active" (KY SOI etch V2 recipe) From mcvittie at snf.stanford.edu Tue Apr 26 15:31:24 2011 From: mcvittie at snf.stanford.edu (mcvittie at snf.stanford.edu) Date: Tue, 26 Apr 2011 15:31:24 -0700 Subject: Problem stsetch2 SNF 2011-04-25 21:11:31: could not process wafers Message-ID: Problem was caused by a antenna flow fault. Was not get green check on PM screen. Disconnected and reconnected all the connector for the antenna cooling loop at the tool. On the PM screen reset the antenna temp controller. Jim From mcvittie at snf.stanford.edu Tue Apr 26 15:33:04 2011 From: mcvittie at snf.stanford.edu (mcvittie at snf.stanford.edu) Date: Tue, 26 Apr 2011 15:33:04 -0700 Subject: Problem stsetch2 SNF 2011-04-22 18:36:11: Same problems as before Message-ID: Unclear message. User need to be clearer in statement of problem. Jim From mcvittie at snf.stanford.edu Tue Apr 26 15:33:32 2011 From: mcvittie at snf.stanford.edu (mcvittie at snf.stanford.edu) Date: Tue, 26 Apr 2011 15:33:32 -0700 Subject: Problem stsetch2 SNF 2011-04-22 18:41:29: Same problem as before Message-ID: Again user was unclear as to what the problem was. From eenriquez at snf.stanford.edu Fri Apr 29 15:11:42 2011 From: eenriquez at snf.stanford.edu (eenriquez at snf.stanford.edu) Date: Fri, 29 Apr 2011 15:11:42 -0700 Subject: Comment stsetch2 SNF 2011-04-29 15:11:41: Update chuck temperature Message-ID: Installed new indium gasket.