Updates on stsetch2
mtang at stanford.edu
Thu Jan 28 15:27:34 PST 2010
Dear stsetch2 users:
As you probably know, there have been several significant hardware and
process changes on stsetch2 over the past several months. Much progress
has been made: kudos to Jim McV and his team of volunteers. Resist
burning is no longer a problem; etch bias can be reduced; profiles can
be tuned; footing on SOI can be minimized.
The purpose of this note is to communicate current plans relevant to
stsetch2 use and to get your feedback.
1. Reservations policy. There is currently no limit (except the 7 day
horizon) on stsetch2. Given the performance, we anticipate that
demand for this system will soon be high. We would like your
inputs on a reservations policy. Just for reference, the policy
for stsetch1 is as follows: 4-day reservation horizon, four hour
limit for a single reservation, four hour limit during prime time.
This means that in a four day window, a labmember can have several
four-hour reservations, even back to back, but a maximum of four
hours during prime time (8 am-6 pm). Some informal suggestions for
modifications for stsetch2 are: no off-prime time limit (easier to
schedule long etches); or a 7-day reservation horizon (to allow
for more planning time.)
2. Training. We have decided to postpone training new users for
approximately 4-6 weeks. The reason is that process development on
the new hardware is still underway. Jim’s team hopes to have three
basic processes to offer in the next several weeks. Once this is
done (and we’ve updated the operating instructions and supporting
training documentation) training will begin again. Inputs on what
you would like to see in terms of documentation and procedures for
new users would be greatly appreciated.
3. Wafer Bonding. Some of Jim’s team have found Crystalbond to be
effective in bonding wafers together. This is approved on a
limited user basis. If you are interested in using this, make sure
to contact Nancy or me for instructions and restrictions (for
example, NO POWDERS allowed in the lab – and training on the
wafersaw room solvent bench.)
Much of the process characterization work is being reviewed in the
STSetch2 users group meeting which is held most Tuesdays at 1 pm. To
join the group, please talk with Jim about your special process needs.
Again, your feedback on reservations policy, training, and process needs
Thanks for your attention –
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA 94305
mtang at stanford.edu
More information about the stsetch2