From edmyers at stanford.edu Mon Nov 12 12:46:59 2012 From: edmyers at stanford.edu (Ed Myers) Date: Mon, 12 Nov 2012 12:46:59 -0800 Subject: PlasmaTherm DRIE Discussion Message-ID: <50A16043.3060101@stanford.edu> All, I would like to meet at 10am on Wednesday, Nov. 14th in 317 Spilker to discuss the PlasmaTherm DRIE system. As many of you know the PlasmaTherm DRIE system has completed it's acceptance. This means, it is now available for process characterization. I would like to meet with the DRIE community to discuss the process needs for the PlasmaTherm system. Please come to discuss your process challenges on the STS systems and what needs to happen on the PlasmaTherm system. If you know anyone who needs DRIE etching, but have not been able to on the STS systems, please make sure they are invited. Regards, Ed From rthowe at stanford.edu Mon Nov 12 13:19:53 2012 From: rthowe at stanford.edu (Roger T. Howe) Date: Mon, 12 Nov 2012 13:19:53 -0800 Subject: PlasmaTherm DRIE Discussion In-Reply-To: <50A16043.3060101@stanford.edu> References: <50A16043.3060101@stanford.edu> Message-ID: <50A167F9.9000209@stanford.edu> Ed, It's great that this is moving forward. Hope everyone can attend. Roger On 11/12/12 12:46 PM, Ed Myers wrote: > All, > > I would like to meet at 10am on Wednesday, Nov. 14th in 317 Spilker to > discuss the PlasmaTherm DRIE system. As many of you know the > PlasmaTherm DRIE system has completed it's acceptance. This means, it > is now available for process characterization. I would like to meet > with the DRIE community to discuss the process needs for the > PlasmaTherm system. > > Please come to discuss your process challenges on the STS systems and > what needs to happen on the PlasmaTherm system. If you know anyone > who needs DRIE etching, but have not been able to on the STS systems, > please make sure they are invited. > > Regards, > Ed From edmyers at stanford.edu Wed Nov 14 14:03:21 2012 From: edmyers at stanford.edu (Ed Myers) Date: Wed, 14 Nov 2012 14:03:21 -0800 Subject: PlasmaTherm DRIE Discussion Minutes 11/14/12 Message-ID: <50A41529.2050101@stanford.edu> All, Here are my notes from today's DRIE discussion. Please let me know if I missed anything. As mentioned during the meeting, the items brought up fall in to two categories. One category relates to policy and the other relates to capability. These are not rank ordered, but are listed in roughly the order they were presented. Policy Related: 1) Gold Contaminated DRIE capability 2) Use of metal hard masks 3) Clearer policy on the use of Crystalbond 4) Ge DRIE etch policy 5) Use of the wafer carrier and protection ring in STSetch2 and PT-DSE Process Capability: 1) High Aspect / Deep Via: 2-20um through wafer etches 2) Verticle Sidewalls: Seeing 70-80 degree slopes on STSetch when etching through a handle wafer 3) No SOI footing: Seeing problems with SOI footing on STSetch 4) No Grassing: Seeing more frequent and random grassing on STSetch 5) No CD expansion: 20um holes become 26um holes during a through wafer etch (STSetch) 6) Reliable sidewall slops: Seeing a lot of variation in profile angles with time (STSetch) 7) Smooth sidewalls: Scalloping of less than 10nm for 100um deep etches 8) Better resist selectivity: Seeing poor selectivity on STSetch2 Action Items: 1) Ed to post the acceptance reports on the wiki 2) Interested lab members to contact Ed to volunteer for recipe development. Commitments: 1) All the new etch systems are available to lab members willing to help develop etch recipes, with the following caveats: A) The recipe development objective must be pre-approved by Ed. B) All results must be shared, by posting on the lab member's wiki. C) No more than 3 runs will be allowed, unless there are published results. D) The Oxford III-V must complete acceptance before it becomes available to lab members for recipe development. E) The correct Operator/Engineer/Maintenance levels and passwords must be established on the tool. Regards, Ed From npapte at stanford.edu Tue Nov 20 20:10:29 2012 From: npapte at stanford.edu (Nikhil Apte) Date: Tue, 20 Nov 2012 20:10:29 -0800 Subject: released reservation tomorrow 9 am to 1 pm... wafers won't be ready Message-ID: released reservation Wednesday 9 am to 1 pm... wafers won't be ready -------------- next part -------------- An HTML attachment was scrubbed... URL: