From mtang at snf.stanford.edu Wed Mar 4 16:00:04 2009 From: mtang at snf.stanford.edu (mtang at snf.stanford.edu) Date: Wed, 4 Mar 2009 16:00:04 -0800 Subject: Problem svgcoat SNF 2009-03-04 16:00:03: Bad EBR Message-ID: I was watching Girish do manual coating. His wafers have a partial ring of spidery threads coming radially out from about 7-8 mm in from the edge. Watching the EBR dispense, it looks like it's sending a steady stream out at a nice angle, and then drips a couple of drops straight down. I would not recommend using EBR on this track. From nvgirish at snf.stanford.edu Wed Mar 4 16:08:33 2009 From: nvgirish at snf.stanford.edu (nvgirish at snf.stanford.edu) Date: Wed, 4 Mar 2009 16:08:33 -0800 Subject: Problem svgcoat SNF 2009-03-04 16:08:32: EBR fopr Prog 3 Message-ID: Dribbling at the end of the cycle. Causes streaks at the wafer edges. From vilanova at snf.stanford.edu Thu Mar 5 07:59:11 2009 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Thu, 5 Mar 2009 07:59:11 -0800 Subject: Problem svgcoat SNF 2009-03-04 16:00:03: Bad EBR Message-ID: checked all the programs ( 2,4,6,7,8, ) and Everything Looks Good EBR and Uniformity , NOW for program # 3 That is for MANUAL dispense (EBEAM) I think is not the EBR Causing the Streaks but it could be the way the resist is dispense or it could be that the Ebeam resist is old. that's all I can think of The EBR dispense Looks Good. From vilanova at snf.stanford.edu Thu Mar 5 07:59:18 2009 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Thu, 5 Mar 2009 07:59:18 -0800 Subject: Problem svgcoat SNF 2009-03-04 16:08:32: EBR fopr Prog 3 Message-ID: checked all the programs ( 2,4,6,7,8, ) and Everything Looks Good EBR and Uniformity , NOW for program # 3 That is for MANUAL dispense (EBEAM) I think is not the EBR Causing the Streaks but it could be the way the resist is dispense or it could be that the Ebeam resist is old. that's all I can think of The EBR dispense Looks Good. From mahnaz at snf.stanford.edu Fri Mar 6 14:31:15 2009 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Fri, 6 Mar 2009 14:31:15 -0800 Subject: Problem svgcoat SNF 2009-03-06 14:31:15: 7 um no good Message-ID: I ran many wafers and cleaned nozzle between each wafer, the 7 um does not look good at all. I see a different color ring on top of the wafer.We even tried to dispense from center only but it just does not look right. Many of you came and complain to me while running the track, I sure appreciate if you log it on the coral. From jwpchen at snf.stanford.edu Sat Mar 7 02:39:14 2009 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Sat, 7 Mar 2009 02:39:14 -0800 Subject: Problem svgcoat SNF 2009-03-07 02:39:13: 7um user report Message-ID: quality greatly improved after fix on 2/25. After resist dispense stroke, one bubble is always visible at center of wafer (happens to both silicon and oxide wafers, so it's not likely a particle on wafer). As rpm ramps up, can observe this single bubble migrate outside radially, leaving a large "comet" track behind. Measured thickness in the comet zone, not always able to get a nanospec reading due to topology slope, got reading from 4um to 10um. Need to overexpose about 25% more than usual to clear the thicker areas reliably, compounded by ongoing developer residue "rings" (humidity?) issue. Good enough for what I need, but YMMV. From jwpchen at snf.stanford.edu Sat Mar 7 02:51:01 2009 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Sat, 7 Mar 2009 02:51:01 -0800 Subject: Comment svgcoat SNF 2009-03-07 02:51:00: EBR pressure Message-ID: the EBR pressure gauge in cabinet reads 5.5psi instead of the marked 7psi; EBR stream droops from gravity more than usual (could be my imagination) and thus carves almost 5mm instead of 2mm... ignore me if that's actually normal pressure From vilanova at snf.stanford.edu Mon Mar 9 08:35:14 2009 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 9 Mar 2009 08:35:14 -0700 Subject: Comment svgcoat SNF 2009-03-07 02:51:00: EBR pressure Message-ID: checked EBR pressure, EBR setting pressure should be 5 ( something more than that will leave EBR residues on the wafers , specially to the thick resist. From vilanova at snf.stanford.edu Mon Mar 9 08:35:40 2009 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 9 Mar 2009 08:35:40 -0700 Subject: Comment svgcoat SNF 2009-03-09 08:35:40: cleaned catch cul , belts and hotplates! Message-ID: From gsosa at snf.stanford.edu Wed Mar 11 11:35:40 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 11 Mar 2009 11:35:40 -0700 Subject: Shutdown svgcoat SNF 2009-03-11 11:35:40: Working on 7.0um Message-ID: From gsosa at snf.stanford.edu Wed Mar 11 18:09:30 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 11 Mar 2009 18:09:30 -0700 Subject: Shutdown svgcoat SNF 2009-03-11 11:35:40: Working on 7.0um Message-ID: 7 micron still has problems with poor spin. Please do not use at this time. From gsosa at snf.stanford.edu Wed Mar 11 18:11:32 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Wed, 11 Mar 2009 18:11:32 -0700 Subject: Problem svgcoat SNF 2009-03-11 18:11:31: 220-7 process down 3/11 Message-ID: 7 micron still has problems with poor spin. Please do not use at this time. From gsosa at snf.stanford.edu Fri Mar 13 09:55:49 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 13 Mar 2009 09:55:49 -0700 Subject: Shutdown svgcoat SNF 2009-03-13 09:55:49: spindle problem Message-ID: Spindle problem From gsosa at snf.stanford.edu Fri Mar 13 15:35:51 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 13 Mar 2009 15:35:51 -0700 Subject: Shutdown svgcoat SNF 2009-03-13 09:55:49: spindle problem Message-ID: Removed spindle and repaired spindle coupling. Re-installed, and re-installed clean catch cup. Performed spindle calibration. All OK. From gsosa at snf.stanford.edu Fri Mar 13 15:39:42 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 13 Mar 2009 15:39:42 -0700 Subject: Comment svgcoat SNF 2009-03-13 15:39:42: 220-7 resist update Message-ID: Installed a rebuilt cybor pump and re-plumbed resist lines with 1/4" OD tubing to dispense head and transitioned down to 3/16/OD x 0.127" ID to dispense point. Also figured out the cybor controller issues with suckback . We now have suckback control. We still need to improve the process. It is probably OK for coverage/protection, but not for imaging. From jsuarez at snf.stanford.edu Mon Mar 16 09:14:39 2009 From: jsuarez at snf.stanford.edu (jsuarez at snf.stanford.edu) Date: Mon, 16 Mar 2009 09:14:39 -0700 Subject: Problem svgcoat SNF 2009-03-16 09:14:39: No EBR Message-ID: Need EBR on 1 mmEBR program From vilanova at snf.stanford.edu Mon Mar 16 09:55:26 2009 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 16 Mar 2009 09:55:26 -0700 Subject: Problem svgcoat SNF 2009-03-16 09:14:39: No EBR Message-ID: Adjusted 1mm EBR , Tested system, cleaned catch cup,belts, hotplates, ok to use. From ahazeghi at snf.stanford.edu Mon Mar 16 17:13:03 2009 From: ahazeghi at snf.stanford.edu (ahazeghi at snf.stanford.edu) Date: Mon, 16 Mar 2009 17:13:03 -0700 Subject: Problem svgcoat SNF 2009-03-16 17:13:03: Track 1 drain alarm Message-ID: turned alarm off From gsosa at snf.stanford.edu Tue Mar 17 12:15:41 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 17 Mar 2009 12:15:41 -0700 Subject: Problem svgcoat SNF 2009-03-16 17:13:03: Track 1 drain alarm Message-ID: The internal waste drain was pumped out and the utility alarm panel turned back on. From gsosa at snf.stanford.edu Tue Mar 17 12:16:19 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Tue, 17 Mar 2009 12:16:19 -0700 Subject: Problem svgcoat SNF 2009-03-16 17:08:16: bad EBR Message-ID: Checked 2 and 5 mm EBR on 1 micron resist. All looks good. From gsosa at snf.stanford.edu Thu Mar 19 13:52:00 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 19 Mar 2009 13:52:00 -0700 Subject: Comment svgcoat SNF 2009-03-19 13:51:59: 220-7 Resist update 3/19 Message-ID: The thick resist process(220-7 resist) is OK to use. The spin quality is greatly improved. The reisit pump has been replaced. The dispense line size to the dispense arm has been changed to 1/4 inch ID x 3/16/ID and reduced down from the dispense arm to the dispense tip to 3/16 inch OD x 1/8 inch ID. Checked and adjusted suckback amount to ~ 1/32" at maximum rate to create a crisp shutoff of resist. Optimized arm program start dispense position, speed of arm travel and a delay time to allow the resist to spread. Checked resist thickness- Target: 7.0 Microns, Measured: 72870 Angstroms Ave.( 7.28 microns) , Std Dev: 75 Angstroms ( measured 13 points). All programs in recipe manage have been updated. There is also a new program named " 4 7.0um 200s Bake Backside EBR. This program does backside wash only. It is still advisable to 1) run several dummy wafers prior to processing your work, 2) Clean the nozzle tip with an acetone moistened swab and 3) clean the nozzle between wafers so the tip does not dry out. Please continue to report any issues in Coral From gsosa at snf.stanford.edu Thu Mar 19 13:52:10 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 19 Mar 2009 13:52:10 -0700 Subject: Problem svgcoat SNF 2009-03-11 18:11:31: 220-7 process down 3/11 Message-ID: The thick resist process(220-7 resist) is OK to use. The spin quality is greatly improved. The reisit pump has been replaced. The dispense line size to the dispense arm has been changed to 1/4 inch ID x 3/16/ID and reduced down from the dispense arm to the dispense tip to 3/16 inch OD x 1/8 inch ID. Checked and adjusted suckback amount to ~ 1/32" at maximum rate to create a crisp shutoff of resist. Optimized arm program start dispense position, speed of arm travel and a delay time to allow the resist to spread. Checked resist thickness- Target: 7.0 Microns, Measured: 72870 Angstroms Ave.( 7.28 microns) , Std Dev: 75 Angstroms ( measured 13 points). All programs in recipe manage have been updated. There is also a new program named " 4 7.0um 200s Bake Backside EBR. This program does backside wash only. It is still advisable to 1) run several dummy wafers prior to processing your work, 2) Clean the nozzle tip with an acetone moistened swab and 3) clean the nozzle between wafers so the tip does not dry out. Please continue to report any issues in Coral From gsosa at snf.stanford.edu Thu Mar 19 13:52:29 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 19 Mar 2009 13:52:29 -0700 Subject: Problem svgcoat SNF 2009-03-07 02:39:13: 7um user report Message-ID: The thick resist process(220-7 resist) is OK to use. The spin quality is greatly improved. The reisit pump has been replaced. The dispense line size to the dispense arm has been changed to 1/4 inch ID x 3/16/ID and reduced down from the dispense arm to the dispense tip to 3/16 inch OD x 1/8 inch ID. Checked and adjusted suckback amount to ~ 1/32" at maximum rate to create a crisp shutoff of resist. Optimized arm program start dispense position, speed of arm travel and a delay time to allow the resist to spread. Checked resist thickness- Target: 7.0 Microns, Measured: 72870 Angstroms Ave.( 7.28 microns) , Std Dev: 75 Angstroms ( measured 13 points). All programs in recipe manage have been updated. There is also a new program named " 4 7.0um 200s Bake Backside EBR. This program does backside wash only. It is still advisable to 1) run several dummy wafers prior to processing your work, 2) Clean the nozzle tip with an acetone moistened swab and 3) clean the nozzle between wafers so the tip does not dry out. Please continue to report any issues in Coral From gsosa at snf.stanford.edu Thu Mar 19 13:52:57 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 19 Mar 2009 13:52:57 -0700 Subject: Problem svgcoat SNF 2009-03-06 14:31:15: 7 um no good Message-ID: The thick resist process(220-7 resist) is OK to use. The spin quality is greatly improved. The reisit pump has been replaced. The dispense line size to the dispense arm has been changed to 1/4 inch ID x 3/16/ID and reduced down from the dispense arm to the dispense tip to 3/16 inch OD x 1/8 inch ID. Checked and adjusted suckback amount to ~ 1/32" at maximum rate to create a crisp shutoff of resist. Optimized arm program start dispense position, speed of arm travel and a delay time to allow the resist to spread. Checked resist thickness- Target: 7.0 Microns, Measured: 72870 Angstroms Ave.( 7.28 microns) , Std Dev: 75 Angstroms ( measured 13 points). All programs in recipe manage have been updated. There is also a new program named " 4 7.0um 200s Bake Backside EBR. This program does backside wash only. It is still advisable to 1) run several dummy wafers prior to processing your work, 2) Clean the nozzle tip with an acetone moistened swab and 3) clean the nozzle between wafers so the tip does not dry out. Please continue to report any issues in Coral From gsosa at snf.stanford.edu Fri Mar 20 12:41:15 2009 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Fri, 20 Mar 2009 12:41:15 -0700 Subject: Problem svgcoat SNF 2009-02-25 09:34:44: 7.0 Micron Status 2/25/09 Message-ID: The thick resist process(220-7 resist) is OK to use. The spin quality is greatly improved. The reisit pump has been replaced. The dispense line size to the dispense arm has been changed to 1/4 inch ID x 3/16/ID and reduced down from the dispense arm to the dispense tip to 3/16 inch OD x 1/8 inch ID. Checked and adjusted suckback amount to ~ 1/32" at maximum rate to create a crisp shutoff of resist. Optimized arm program start dispense position, speed of arm travel and a delay time to allow the resist to spread. Checked resist thickness- Target: 7.0 Microns, Measured: 72870 Angstroms Ave.( 7.28 microns) , Std Dev: 75 Angstroms ( measured 13 points). All programs in recipe manage have been updated. There is also a new program named " 4 7.0um 200s Bake Backside EBR. This program does backside wash only. It is still advisable to 1) run several dummy wafers prior to processing your work, 2) Clean the nozzle tip with an acetone moistened swab and 3) clean the nozzle between wafers so the tip does not dry out. Please continue to report any issues in Coral From mahnaz at snf.stanford.edu Mon Mar 30 14:08:16 2009 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Mon, 30 Mar 2009 14:08:16 -0700 Subject: Problem svgcoat SNF 2009-03-30 14:08:16: 3612 too much dispense Message-ID: just by look is more than 8-10 ml. From mahnaz at snf.stanford.edu Mon Mar 30 14:19:22 2009 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Mon, 30 Mar 2009 14:19:22 -0700 Subject: Problem svgcoat SNF 2009-03-30 14:19:22: EBR back splash Message-ID: Ran 4 wafers with 1 um 3612, two wafers came out with EBR splash all the way to center.