From vilanova at snf.stanford.edu Thu May 1 07:33:35 2003 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: May 1, 2003 7:33:35 AM Subject: Problem svgdev 2003-04-30 17:59:30: Report Clear for svgdev Message-ID: FOund the AC Adapter Disconnected from Coral Box. Ok to use now. From caudillo at snf.stanford.edu Thu May 1 01:34:42 2003 From: caudillo at snf.stanford.edu (caudillo at snf.stanford.edu) Date: May 1, 2003 1:34:42 PM Subject: Shutdown svgdev 2003-05-01 13:34:41: Report Shutdown for svgdev Message-ID: Not sensing the wafer. It will load to chuch but will not spin. From vilanova at snf.stanford.edu Fri May 2 11:19:27 2003 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: May 2, 2003 11:19:27 AM Subject: Shutdown svgdev 2003-05-01 13:34:41: Report Clear for svgdev Message-ID: Replaced Sensor Dual Board, Cycled wafers Ok to use . From erics at snf.stanford.edu Sun May 4 06:17:35 2003 From: erics at snf.stanford.edu (erics at snf.stanford.edu) Date: May 4, 2003 6:17:35 PM Subject: Problem svgdev 2003-05-04 18:17:34: Report Problem for svgdev Message-ID: whenever I develop SPR220-7 ~7um I notice that the first puddle does not cover the whole wafer surface. I imagine that many people that use this recipe are haveing the same problem because I notice it every time I run the program. I have quickly talked to Mike M. about it but am not sure if he relayed the information. It seems to me to be related to a surface tension effect. I think that if there was a light water spray before the first develop puddle it would break the surface tension and relieve the problem. From vilanova at snf.stanford.edu Mon May 5 07:34:37 2003 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: May 5, 2003 7:34:37 AM Subject: Problem svgdev 2003-05-04 18:17:34: Report Clear for svgdev Message-ID: The problem with is more related to the resist than to the developer track ,because we;ve increased the developer and water flow and we get the same result. so I think this is more related to the chemical (SPR220-7) than to the tracks. From beckwith at cis.stanford.edu Mon May 5 11:11:01 2003 From: beckwith at cis.stanford.edu (Sharleen Beckwith) Date: Mon, 5 May 2003 11:11:01 -0700 Subject: Problem svgdev 2003-05-04 18:17:34: Report Problem for svgdev In-Reply-To: <20030505011738.9421CCA6CC@cis.Stanford.EDU> References: <20030505011738.9421CCA6CC@cis.Stanford.EDU> Message-ID: At 6:17 AM -0700 5/4/03, erics at snf.stanford.edu wrote: >whenever I develop SPR220-7 ~7um I notice that the first puddle does >not cover the whole wafer surface. I imagine that many people that >use this recipe are haveing the same problem because I notice it >every time I run the program. I have quickly talked to Mike M. about >it but am not sure if he relayed the information. It seems to me to >be related to a surface tension effect. I think that if there was a >light water spray before the first develop puddle it would break the >surface tension and relieve the problem. I have seem this problem also. I usually take a swab and carefully push the developer around on the wafer until it is completely covered. Low tech, but it works. Sharleen -- "When war, like the one now in Iraq, threatens the fate of humanity, it is even more urgent for us to proclaim, with a firm and decisive voice, that only peace is the way of building a more just and caring society. Violence and weapons can never resolve the problems of man." Pope John Paul II, commenting on the U. S. invasion of Iraq, March 2003 From rohits at snf.stanford.edu Fri May 30 02:15:14 2003 From: rohits at snf.stanford.edu (rohits at snf.stanford.edu) Date: May 30, 2003 2:15:14 AM Subject: Comment svgdev 2003-05-30 02:15:14: Report Comment for svgdev Message-ID: Svgdev and dev2 wouldn't move wafers from the send indexer. So I went ahead and refilled LDD26W into the canister in the fingerwall. Refill amount was around 2 gallons. Things worked fine after refilling developer. -- Rohit