Problem svgdev 2003-05-04 18:17:34: Report Problem for svgdev
beckwith at cis.stanford.edu
Mon May 5 11:11:01 PDT 2003
At 6:17 AM -0700 5/4/03, erics at snf.stanford.edu wrote:
>whenever I develop SPR220-7 ~7um I notice that the first puddle does
>not cover the whole wafer surface. I imagine that many people that
>use this recipe are haveing the same problem because I notice it
>every time I run the program. I have quickly talked to Mike M. about
>it but am not sure if he relayed the information. It seems to me to
>be related to a surface tension effect. I think that if there was a
>light water spray before the first develop puddle it would break the
>surface tension and relieve the problem.
I have seem this problem also. I usually take a swab and carefully
push the developer around on the wafer until it is completely
covered. Low tech, but it works.
"When war, like the one now in Iraq, threatens the fate of humanity,
it is even more urgent for us to proclaim, with a firm and decisive voice,
that only peace is the way of building a more just and caring society.
Violence and weapons can never resolve the problems of man."
Pope John Paul II, commenting on the U. S. invasion of Iraq, March 2003
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