From rik at snf.stanford.edu Wed Mar 7 02:47:46 2007 From: rik at snf.stanford.edu (rik at snf.stanford.edu) Date: Wed, 7 Mar 2007 02:47:46 -0800 Subject: Comment svgdev2 SNF 2007-03-07 02:47:46: Developer rings on backside of wafer Message-ID: I am getting rings matching the chuck on the backside of my wafer after running it through the developer track. I tried wiping the chuck, which helped but it did not get rid of all the rings. From sjo at snf.stanford.edu Tue Mar 13 21:11:09 2007 From: sjo at snf.stanford.edu (sjo at snf.stanford.edu) Date: Tue, 13 Mar 2007 21:11:09 -0700 Subject: Problem svgdev2 SNF 2007-03-13 21:11:08: Snap & Bounce Message-ID: When the wafer alignment stop retracts on the spinner, it snaps back so fast that the wafer bounces up and against the developer nozzles. This leaves marks and developer droplets on the wafer. This is especially a problem when trying to cycle wafers for baking only, e.g. post-exposure bake. This is similar to what happened on the coater. What's going on, did the pneumatic air pressure accidentally increase, making all machines snap too fast...? From sjo at snf.stanford.edu Tue Mar 13 21:16:44 2007 From: sjo at snf.stanford.edu (sjo at snf.stanford.edu) Date: Tue, 13 Mar 2007 21:16:44 -0700 Subject: Problem svgdev2 SNF 2007-03-13 21:16:44: Damages wafer Message-ID: When running developer program 9 (no develop, bake only), the arm snaps back very fast and makes the wafer bounce up against nozzles, leaving clear indentation mark & scratch on the wafer surface. From vilanova at snf.stanford.edu Wed Mar 14 13:34:05 2007 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Wed, 14 Mar 2007 13:34:05 -0700 Subject: Problem svgdev2 SNF 2007-03-13 21:11:08: Snap & Bounce Message-ID: Adjusted the iar pressure to the amr opening & closing cycled wafers, Good to use. From vilanova at snf.stanford.edu Wed Mar 14 13:34:19 2007 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Wed, 14 Mar 2007 13:34:19 -0700 Subject: Problem svgdev2 SNF 2007-03-13 21:16:44: Damages wafer Message-ID: read previous message. From kimsangb at snf.stanford.edu Wed Mar 21 20:41:49 2007 From: kimsangb at snf.stanford.edu (kimsangb at snf.stanford.edu) Date: Wed, 21 Mar 2007 20:41:49 -0700 Subject: Shutdown svgdev2 SNF 2007-03-21 20:41:49: Wafer got broken in the spinner. Message-ID: From gsosa at snf.stanford.edu Thu Mar 22 08:38:19 2007 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Thu, 22 Mar 2007 08:38:19 -0700 Subject: Shutdown svgdev2 SNF 2007-03-21 20:41:49: Wafer got broken in the spinner. Message-ID: Removed shrouds and cleaned out broken wafer. Tested with dummy wafers. Chuck vacuum OK. Wafer transfer OK. System ready to use.