Problem svgdev2 SNF 2007-03-13 21:11:08: Snap & Bounce

sjo at snf.stanford.edu sjo at snf.stanford.edu
Tue Mar 13 21:11:09 PDT 2007


When the wafer alignment stop retracts on the spinner, it snaps back so fast that the wafer bounces up and against the developer nozzles. This leaves marks and developer droplets on the wafer. This is especially a problem when trying to cycle wafers for baking only, e.g. post-exposure bake. This is similar to what happened on the coater. What's going on, did the pneumatic air pressure accidentally increase, making all machines snap too fast...?




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