From mahnaz at snf.stanford.edu Wed Nov 7 16:45:09 2007 From: mahnaz at snf.stanford.edu (mahnaz at snf.stanford.edu) Date: Wed, 7 Nov 2007 16:45:09 -0800 Subject: Comment svgdev2 SNF 2007-11-07 16:45:08: Message-ID: I am sending this email out with regards to developing asml wafers with 955-.7 I line resist. If you see the circular ring on your wafers you may choose to develop with program 5 on the SVGdev2 which Is exact copy of program 2 without the rinse. I have ran some wafers and still waiting for SEM result, till I get the result and be able to run more tests might be a while so I thought to share the information with you all. From gibby at snf.stanford.edu Thu Nov 8 06:14:40 2007 From: gibby at snf.stanford.edu (gibby at snf.stanford.edu) Date: Thu, 8 Nov 2007 06:14:40 -0800 Subject: Problem svgdev2 SNF 2007-11-08 06:14:40: Resist under developed around edge of wafer Message-ID: This is the same problem that we have seen before. ~1cm ring of under developed resist around the edge of the wafer. I've run wafers identically without seeing this problem for the past few weeks. From gibby at snf.stanford.edu Wed Nov 14 14:48:38 2007 From: gibby at snf.stanford.edu (gibby at snf.stanford.edu) Date: Wed, 14 Nov 2007 14:48:38 -0800 Subject: Comment svgdev2 SNF 2007-11-14 14:48:38: Program 5 Develop results Message-ID: Ran program 5 without problems. 1um 955 resist; smallest feature resolved: 0.35 um. Exposure: ASML, 130 mJ/cm2, -0.2 um focus offset. Uniform coat, exposure, development.