Problem svgdev2 SNF 2009-07-09 21:35:25: Resist Mark on the back after processing

alsune at snf.stanford.edu alsune at snf.stanford.edu
Thu Jul 9 21:35:26 PDT 2009


Found decent amount of PR marks on the back of the wafer after developing. It seems that the PR got on either the hot plate or the vacuum plate on the developer chamber. Requires cleaning so that it does not cause problem if someone should want to go into the ASML again.




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