From faridz at snf.stanford.edu Wed Mar 3 11:39:29 2010 From: faridz at snf.stanford.edu (faridz at snf.stanford.edu) Date: Wed, 3 Mar 2010 11:39:29 -0800 Subject: Problem svgdev2 SNF 2010-03-03 11:39:29: back side of the wafer comming out wet Message-ID: From vilanova at snf.stanford.edu Wed Mar 3 14:45:12 2010 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Wed, 3 Mar 2010 14:45:12 -0800 Subject: Problem svgdev2 SNF 2010-03-03 11:39:29: back side of the wafer comming out wet Message-ID: adjusted bottom EBR Nozzle, cycled many wafers, wafers backside nice and clean , ok to use. From nharjee at snf.stanford.edu Sun Mar 7 16:47:41 2010 From: nharjee at snf.stanford.edu (nharjee at snf.stanford.edu) Date: Sun, 7 Mar 2010 16:47:41 -0800 Subject: Problem svgdev2 SNF 2010-03-07 16:47:40: Inconsiderate users... Message-ID: ..have modified Prog 7. My wafer wasn't developed properly, and was left wet at the end of the program. From vilanova at snf.stanford.edu Mon Mar 8 08:40:02 2010 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Mon, 8 Mar 2010 08:40:02 -0800 Subject: Problem svgdev2 SNF 2010-03-07 16:47:40: Inconsiderate users... Message-ID: This is why you have to check your program before YOu Use it. checked program and changed it baqck to normal speed, Ok to use. From faridz at snf.stanford.edu Mon Mar 15 12:19:48 2010 From: faridz at snf.stanford.edu (faridz at snf.stanford.edu) Date: Mon, 15 Mar 2010 12:19:48 -0700 Subject: Problem svgdev2 SNF 2010-03-15 12:19:47: backside of the wafers are wet????? Message-ID: From gsosa at snf.stanford.edu Mon Mar 15 14:41:57 2010 From: gsosa at snf.stanford.edu (gsosa at snf.stanford.edu) Date: Mon, 15 Mar 2010 14:41:57 -0700 Subject: Problem svgdev2 SNF 2010-03-15 12:19:47: backside of the wafers are wet????? Message-ID: Checked and adjusted angle of backside rinse nozzle. Also, program 3 had a few errors in the program including the 2 puddle steps. Should have been 20 seconds instead of 2 seconds. Corrected the program. Tested system several times with test wafers. Backsides of wafers now coming out dry. From jwpchen at snf.stanford.edu Tue Mar 16 07:04:20 2010 From: jwpchen at snf.stanford.edu (jwpchen at snf.stanford.edu) Date: Tue, 16 Mar 2010 07:04:20 -0700 Subject: Problem svgdev2 SNF 2010-03-16 07:04:20: developer residue Message-ID: nice impression of spinner chuck on wafer backsides... other users report the nozzle(s) sometimes drip From vilanova at snf.stanford.edu Tue Mar 16 11:02:33 2010 From: vilanova at snf.stanford.edu (vilanova at snf.stanford.edu) Date: Tue, 16 Mar 2010 11:02:33 -0700 Subject: Problem svgdev2 SNF 2010-03-16 07:04:20: developer residue Message-ID: adjusted bottom nozzle and cycled wafers . back of wafers nice and dry and clean, ok to use. From zpatel at snf.stanford.edu Fri Mar 26 16:53:22 2010 From: zpatel at snf.stanford.edu (zpatel at snf.stanford.edu) Date: Fri, 26 Mar 2010 16:53:22 -0700 Subject: Comment svgdev2 SNF 2010-03-26 16:53:22: Wafer not landing properly on hot plate Message-ID: