From mislam at snf.stanford.edu Thu May 6 01:54:01 2010 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Thu, 6 May 2010 01:54:01 -0700 Subject: Shutdown teos2 SNF 2010-05-06 01:54:00: Pressure not steady during dep Message-ID: Durring deposition pressure keeps rising, eventually deposition stops. Tried 3 times with same result. Base pressure kind of high. From seymour at snf.stanford.edu Thu May 6 09:56:48 2010 From: seymour at snf.stanford.edu (seymour at snf.stanford.edu) Date: Thu, 6 May 2010 09:56:48 -0700 Subject: Shutdown teos2 SNF 2010-05-06 01:54:00: Pressure not steady during dep Message-ID: baked out the pump line trap. base pressure and ROR are good. Process pressure with 500 SCCM N2 was 440 mT. System looks good. needs a test From seymour at snf.stanford.edu Thu May 6 09:57:16 2010 From: seymour at snf.stanford.edu (seymour at snf.stanford.edu) Date: Thu, 6 May 2010 09:57:16 -0700 Subject: Problem teos2 SNF 2010-05-06 09:57:16: needs test after baking out pump line trap. Message-ID: From mislam at snf.stanford.edu Fri May 7 01:54:47 2010 From: mislam at snf.stanford.edu (mislam at snf.stanford.edu) Date: Fri, 7 May 2010 01:54:47 -0700 Subject: Comment teos2 SNF 2010-05-07 01:54:46: Run ok, thickness as expected Message-ID: dep rate 50A/min with TEOS2STD From tberg at snf.stanford.edu Fri May 7 06:26:59 2010 From: tberg at snf.stanford.edu (tberg at snf.stanford.edu) Date: Fri, 7 May 2010 06:26:59 -0700 Subject: Problem teos2 SNF 2010-05-06 09:57:16: needs test after baking out pump line trap. Message-ID: Run by next user OK From tberg at snf.stanford.edu Fri May 7 06:27:12 2010 From: tberg at snf.stanford.edu (tberg at snf.stanford.edu) Date: Fri, 7 May 2010 06:27:12 -0700 Subject: Comment teos2 SNF 2010-05-07 01:54:46: Run ok, thickness as expected Message-ID: Thanks