From maurice at snf.stanford.edu  Fri Oct 12 10:48:44 2007
From: maurice at snf.stanford.edu (maurice at snf.stanford.edu)
Date: Fri, 12 Oct 2007 10:48:44 -0700
Subject: Problem thermco1 SNF 2007-09-29 23:57:44: Need that backup wand for the Thermco bank
Message-ID: <mailman.101.1356283514.4788.thermco1-pcs@snf.stanford.edu>

investigating wand issue
logged



From king at snf.stanford.edu  Tue Oct 16 00:51:47 2007
From: king at snf.stanford.edu (king at snf.stanford.edu)
Date: Tue, 16 Oct 2007 00:51:47 -0700
Subject: Problem thermco1 SNF 2007-10-16 00:51:46: Nonuniform dry ox
Message-ID: <mailman.102.1356283514.4788.thermco1-pcs@snf.stanford.edu>

Grew a a 200A dry ox and some areas were about 40A thicker, in the same areas of each wafers (measureing on bare Si).  
You may want to do a test before committing critical wafers.