From skoh at snf.stanford.edu  Thu Apr 23 19:28:06 2009
From: skoh at snf.stanford.edu (skoh at snf.stanford.edu)
Date: Thu, 23 Apr 2009 19:28:06 -0700
Subject: Problem thermco2 SNF 2009-04-23 19:28:05: Poor intra wafer uniformity for dryox
Message-ID: <mailman.152.1356283531.4803.thermco2-pcs@snf.stanford.edu>

Ran 2Dryox 950C for 1hr.  15 wafers. Loaded flats up. Expected ~350A.  Center of wafers was 350A to 360A for all wafers.   But within the wafer, thickness was significantly higher (about 410A) near the flat, as measured on woollam.  This was significantly worse than what I obtained when I ran the same recipe 2 days ago.