Comment tylan2 SNF 2011-10-17 17:39:46: 50 um thickness wafer bonded to Si substrate

jaehlee at snf.stanford.edu jaehlee at snf.stanford.edu
Mon Oct 17 17:39:46 PDT 2011


About 20% of the bonded thin wafer got shattered while annealing in  the furnace.  




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