From rohits at snf.stanford.edu Mon Aug 11 11:50:09 2003 From: rohits at snf.stanford.edu (rohits at snf.stanford.edu) Date: Aug 11, 2003 11:50:09 PM Subject: Problem tylanbpsg 2003-08-11 23:50:09: high leak rate and MFS alarm for LTO450P Message-ID: Measured a high leak rate of 54.2 mtorr/min (65.4-11.2) for this recipe. From the logbook, it appears that the previous user who ran this recipe right before me also got a high leak rate of 85 mtorr/min (96.2-11.2). The deposited film looked very uniform (<3% sigma intrawafer), though the dep rate was higher than expected. Flow rates and process pressure met targets SiH4=7.8sccm, O2=87 sccm. process pressure=250 mtorr. Also, there is an MFS alarm during step 115 (vent - backfill). The panel at the back reads PPC.PGNTLK. Previous users have also seen this problem. This is most probably due to the furnace attempting to maintain process pressure even when the gate valve is closed and tube vented. This could be prevented by inserting PRCPR=OFF and PRCPR=0 in one of the steps after the deposition is over. thanks, -- Rohit From mdickey at snf.stanford.edu Tue Aug 12 06:25:43 2003 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Aug 12, 2003 6:25:43 AM Subject: Comment tylanbpsg 2003-08-12 06:25:43: Report Comment for tylanbpsg Message-ID: A leak check was done. Based at 6 m.t. with a rate of rise at 1-2 m.t. a min. Suspect wet wafers or outgassing caused the previous high leak rate. From tberg at snf.stanford.edu Thu Aug 14 06:30:54 2003 From: tberg at snf.stanford.edu (tberg at snf.stanford.edu) Date: Aug 14, 2003 6:30:54 AM Subject: Shutdown tylanbpsg 2003-08-14 06:30:50: Report Shutdown for tylanbpsg Message-ID: Burn box pressure high From tberg at snf.stanford.edu Thu Aug 14 06:53:05 2003 From: tberg at snf.stanford.edu (tberg at snf.stanford.edu) Date: Aug 14, 2003 6:53:05 AM Subject: Shutdown tylanbpsg 2003-08-14 06:30:50: Report Clear for tylanbpsg Message-ID: Cleaned burn box From maurice at snf.stanford.edu Wed Aug 20 09:46:38 2003 From: maurice at snf.stanford.edu (maurice at snf.stanford.edu) Date: Aug 20, 2003 9:46:38 AM Subject: Problem tylanbpsg 2003-08-11 23:50:09: Report Clear for tylanbpsg Message-ID: Problem is specific to LTO450P program. The program is being changed. From mdickey at snf.stanford.edu Thu Aug 21 06:05:21 2003 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Aug 21, 2003 6:05:21 AM Subject: Shutdown tylanbpsg 2003-08-21 06:05:21: Report Shutdown for tylanbpsg Message-ID: Down for pull and clean From mdickey at snf.stanford.edu Thu Aug 21 01:47:20 2003 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Aug 21, 2003 1:47:20 PM Subject: Comment tylanbpsg 2003-08-21 13:47:19: Report Comment for tylanbpsg Message-ID: Pull and clean is done. System is being coated. From maurice at snf.stanford.edu Thu Aug 21 06:44:19 2003 From: maurice at snf.stanford.edu (maurice at snf.stanford.edu) Date: Aug 21, 2003 6:44:19 PM Subject: Shutdown tylanbpsg 2003-08-21 06:05:21: Report Clear for tylanbpsg Message-ID: pulled, cleaned, replaced, tested. Green light From maurice at snf.stanford.edu Thu Aug 28 05:06:20 2003 From: maurice at snf.stanford.edu (maurice at snf.stanford.edu) Date: Aug 28, 2003 5:06:20 PM Subject: Shutdown tylanbpsg 2003-08-28 17:06:19: Report Shutdown for tylanbpsg Message-ID: Failed leak check twice. Failed in gross leakcheck step 30 of LTO400 program. From mdickey at snf.stanford.edu Fri Aug 29 07:49:47 2003 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Aug 29, 2003 7:49:47 AM Subject: Comment tylanbpsg 2003-08-29 07:49:46: Report Comment for tylanbpsg Message-ID: Found t.c. sheath to be broken. Replaced it and vacuumed out quartz particles. Currently purging. From mdickey at snf.stanford.edu Fri Aug 29 08:26:05 2003 From: mdickey at snf.stanford.edu (mdickey at snf.stanford.edu) Date: Aug 29, 2003 8:26:05 AM Subject: Shutdown tylanbpsg 2003-08-28 17:06:19: Report Clear for tylanbpsg Message-ID: Replaced broken t.c. sheath. Checked boat in/out...good Tube base pressure and rate of rise good. Should be ready for use.