From mjenkins at snf.stanford.edu Tue Dec 12 11:23:48 2000 From: mjenkins at snf.stanford.edu (mjenkins at snf.stanford.edu) Date: Dec 12, 2000 11:23:48 AM Subject: Problem wafersaw: Blade stuck on saw Message-ID: The blade on the wafersaw now (12/12/00 11:00am) is a blade for cutting silicon with exposure 1.777 mm. I can't get it off, and Mary wasn't around to help. If you can remove it, please dispose of it, as the blade is coming off it's mounting ring. From shott at snf.stanford.edu Tue Dec 12 04:59:27 2000 From: shott at snf.stanford.edu (shott at snf.stanford.edu) Date: Dec 12, 2000 4:59:27 PM Subject: Problem wafersaw: Re: Blade stuck on saw Message-ID: I've extracted the stuck blade and wiped everything down. I did not, however, install a new blade because I wasn't sure which blade was required. Happy sawing, John From shott at snf.stanford.edu Tue Dec 12 17:22:46 2000 From: shott at snf.stanford.edu (John Shott) Date: Tue, 12 Dec 2000 17:22:46 -0800 Subject: Problem wafersaw: Blade stuck on saw Message-ID: <3A36CF66.C8BAA9F6@snf.stanford.edu> This is a test ... I already cleared the actual problem, but I wanted to see what the mailing list archive would do when I had "Re: ..." in the subject line (or whether it actually needs some sort of reply to field ...) From jonkurz at snf.stanford.edu Thu Dec 14 05:10:25 2000 From: jonkurz at snf.stanford.edu (jonkurz at snf.stanford.edu) Date: Dec 14, 2000 5:10:25 PM Subject: Problem wafersaw 2000-12-14 17:10:21: blades jam on spindle Message-ID: Blades cannot be changed anymore -- after they get screwed on (even with reasonable pressure), they get jammed onto the spindle. Removing them with a pliers (or with the nitrogen off) is probably bad for the bearings. From jonkurz at snf.stanford.edu Thu Dec 14 05:11:53 2000 From: jonkurz at snf.stanford.edu (jonkurz at snf.stanford.edu) Date: Dec 14, 2000 5:11:53 PM Subject: Problem wafersaw 2000-12-14 17:11:52: water pressure setting? Message-ID: Someone keeps resetting the water pressure to 10 gpm. This may be OK for cutting silicon, but I think it's not okay for cutting materials with lower thermal conductivity. Is there a reccomended setting? From jonkurz at snf.stanford.edu Thu Dec 14 05:16:17 2000 From: jonkurz at snf.stanford.edu (jonkurz at snf.stanford.edu) Date: Dec 14, 2000 5:16:17 PM Subject: Problem wafersaw 2000-12-14 17:16:16: x-y miscalibration (a recurring problem) Message-ID: After four cuts in index I, the fifth cut stopped short of the wafer edge. Since I programmed 4.5" dia for a 3" wafer, this is pretty bad. I finished the cut by reprogramming for 6" dia, but this time the cut started in the middle of the wafer -- an error which can often lead to disaster. From booth at snf.stanford.edu Mon Dec 18 06:53:51 2000 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Dec 18, 2000 6:53:51 PM Subject: Problem wafersaw 2000-12-14 17:16:16: x-y miscalibration (a recurring problem) Message-ID: best approach is to ALWAYS set wafer size to 150mm. There is no fix available - we have to live with it. From booth at snf.stanford.edu Mon Dec 18 06:55:31 2000 From: booth at snf.stanford.edu (booth at snf.stanford.edu) Date: Dec 18, 2000 6:55:31 PM Subject: Problem wafersaw 2000-12-14 17:11:52: water pressure setting? Message-ID: Adjust the water flow as required. It should not be so high that the water splashes out of the machine.