Comment wafersaw SNF 2007-03-21 02:42:48: Spindle Overload & Blade Run-In

mtang at snf.stanford.edu mtang at snf.stanford.edu
Tue Mar 27 14:29:20 PDT 2007


This is a bug in the system.  It assumes when you do street alignment that you are roughly in the middle of your substrate.  If you specify a round substrate, it will cut a narrower X range near the "top" and "bottom" and wider in the "middle."  If you align at the flat, it assumes that this is the middle of your wafer...  So, if you align at the flat, use the rectangular substrate or set your diameter to 150 mm.   See section 7 (Troubleshooting) of the operating procedures.




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