From huangzb at snf.stanford.edu  Tue Jun  7 15:31:53 2011
From: huangzb at snf.stanford.edu (huangzb at snf.stanford.edu)
Date: Tue, 7 Jun 2011 15:31:53 -0700
Subject: Problem wafersaw SNF 2011-06-07 15:31:52: wafer saw cut wafer center and broke blade
Message-ID: <mailman.994.1357938994.26017.wafersaw-pcs@snf.stanford.edu>

I was cutting a 4 inch quartz wafer with resin blade. I set the wafer diamter as 110mm and cutting rate 1mm/s. For some reason when I started single cut, the wafer saw cut from somewhere between the center and the edge and broke the blade.



From yuxinz at snf.stanford.edu  Wed Jun  8 18:02:27 2011
From: yuxinz at snf.stanford.edu (yuxinz at snf.stanford.edu)
Date: Wed, 8 Jun 2011 18:02:27 -0700
Subject: Problem wafersaw SNF 2011-06-08 18:02:27: blade broken during dicing
Message-ID: <mailman.995.1357938994.26017.wafersaw-pcs@snf.stanford.edu>

clean the chuck and spindle but more cleaning might be needed