From acremann at slac.stanford.edu  Tue Jun 29 13:45:03 2004
From: acremann at slac.stanford.edu (Yves Acremann)
Date: Tue, 29 Jun 2004 13:45:03 -0700
Subject: cutting wafers with SiN membranes
Message-ID: <40E1D4CF.8000902@slac.stanford.edu>

Hi

I need to cut a Si wafer with SiN membranes (approx. 100um in size, 
300nm thick low stress LPCVD nitride).
Does anybody have some experience in cutting a wafer with membranes 
using the saw? I know that
the saw is quite a rough machine...

Thanks
Yves