From vishal at thorrn.com  Mon Dec 12 11:21:16 2005
From: vishal at thorrn.com (Vishal Singhal)
Date: Mon, 12 Dec 2005 11:21:16 -0800
Subject: Depth of cut
Message-ID: <fd5626040512121121v20c9d8b9x6fc87a76475985b2@mail.gmail.com>

Hello wafer saw users,

I am planning to use the wafer saw to cut borosilicate glass (masks)
with thickness of 0.060" (approximately 1.5mm).

If anybody has experience doing this, can you tell me whether I can
cut this much depth with a single pass or should I make mutiple passes
with increasing depths.  What is the maximum recommended depth of cut
for a single cut.  Are there other recommendations for cutting quartz
and glass wafers.

Thanks,
Vishal

--
Vishal Singhal
Thorrn Micro Technologies, Inc.
650-556-1248
vishal at thorrn.com


From iwjung at stanford.edu  Thu Dec 15 23:25:11 2005
From: iwjung at stanford.edu (Il Woong Jung)
Date: Thu, 15 Dec 2005 23:25:11 -0800
Subject: reservation removed 1am-3am
Message-ID: <1134717911.43a26bd7c1f3b@webmail.stanford.edu>



Sorry for late notice. Hope someone can use it.