From mtang at stanford.edu  Mon Nov 22 15:08:37 2010
From: mtang at stanford.edu (Mary Tang)
Date: Mon, 22 Nov 2010 15:08:37 -0800
Subject: Problem wafersaw SNF 2010-11-20 12:48:32: Resin blade broken
In-Reply-To: <20101120204832.82F024561DB@smtp-unencrypted.stanford.edu>
References: <20101120204832.82F024561DB@smtp-unencrypted.stanford.edu>
Message-ID: <4CEAF7F5.8000100@stanford.edu>

Hi all who have experienced problems with broken resinoid blades....   A 
couple of questions:

1.  Are you aligning to the wafer flat or features/street near the edge 
of the wafer?

2.  Are you cutting a round substrate and using "diameter" to specify 
your substrate dimension?

If you answered "yes" to both, then please review section 7 
(troubleshooting common problems) in the operating procedures.  If not, 
please let me know when you next plan to use the system as I'd like to 
work with you.

Thanks,

Mary

carterlin at snf.stanford.edu wrote:
> Resin blades break repeatively during cutting, with either blade holder. Blades are okay for several successful cuts, but break when the cutter head moves over to above the wafer and drops vertically down, rather than feeding the wafer horizontally to the blades. This problem occurs with several users.
>
>   


-- 
Mary X. Tang, Ph.D.
Stanford Nanofabrication Facility
CIS Room 136, Mail Code 4070
Stanford, CA  94305
(650)723-9980
mtang at stanford.edu
http://snf.stanford.edu