Comment yes 2004-02-05 08:54:11: bad adhesion update

lindaw at snf.stanford.edu lindaw at snf.stanford.edu
Thu Feb 5 08:54:12 PST 2004


I went with a regular singe and track2 vapor prime and coat, and the adhesion looks good after hot plate bake. No pulling away from the wafer edge at all. Summary:
Wafers out of furnace, sit overnight, Vapor prime =bad adhesion
Sulfuric strip and vapor prime =bad adhesion
sulfuric strip and singe, prime on track = visually better adhesion.




More information about the yes-pcs mailing list