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aw610 Operating Instructions

operating instructions for the aw610_l and the aw610_r Rapid Thermal Process annealing systems.

Allwin 610 Rapid Thermal Process Systems (aw610)


1. Overview 

 

The aw610 systems are rapid thermal processing (RTP) systems, which use high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The systems are capable of annealing substrates in a variety of ambients: N2, Ar, forming gas (N2:H2), O2, N2O and NH3. Each system is a cold wall, quartz chamber, which is heated with top and bottom arrays of high intensity halogen lamps using a closed-loop temperature control using either a pyrometer or a thermocouple.

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2. Training Procedure for Users

 
This tool requires a 1-hour training session for qualification. Please contact Maurice Stevens to schedule training. 

3. Contact List (Name, Email, Office, Phone) 

 

Process Staff: Maurice Stevens (maurice@stanford.edu)

Maintenance: Jim Haydon  (jhaydon@snf.stanford.edu) 

4. Tool location 


The tool is located at grid B6 on the Lab Map. It is the first aisle to the left as you enter from the gowning room, between the Metallica and the Savannah.

5. Cleanliness Standard 


aw610_l is in the clean and semi-cleanprocess group and aw610_r is gold-contaminated.

6. Wafer handling 

The wafer to be processed is manually placed on a quartz tray that slides into the chamber.  4", 5" and 6" wafers can be used, and pieces must be loaded on an appropriate carrier wafer. 

7. Operating Procedures

  1. Enable the system on CORAL. The system should display the main menu shown below.  If this screen is not present press the “Esc” on the keyboard until it appears.

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  1. Open system and place your wafer on the quartz tray.  Close the door and ensure it is fully latched.

  2. From the Main Menu, click ‘Process for Engineer’ which should bring up this screen.

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  1. Click to select a Recipe from the list of Recipes in the column “Recipe File”. You can scroll through the list of filenames by using the slider to the right of the list, or using the up and down arrow keys on the keyboard. A selected filename is highlighted in red. You can also select a filename by manually typing in the filename into the field above the list.

WARNING: Selecting a filename and pressing DEL on the keyboard permanently deletes the file.

  1. Select the folder with your username (created during the training session) under “Dir ID”. Select or create a “Lot ID” from the list of Lot IDs.This specifies where the process data is stored upon completion.

  1. To run the selected Recipe, click on the Start Process button. This will display the Process Monitor screen while the process is running. The Process Monitor screen shows a completed process curve. In this figure, the x-axis indicates the process time and the y-axis indicates the measured process temperature. The curves display aspects of the monitored process:

  • Green: recipe temperature as defined by the Recipe.

  • Black: Model (ideal) temperature curve.

  • Blue: real, measured temperature during the wafer process.

  • Red: The lamp intensity (power percentage) during the wafer process. The range is from 0 to 100.

  • Light Blue: temperature feedback from the thermocouple.

  • Pink: temperature feedback from the pyrometer. The temperature from this pyrometer is not reliable below 450 °C.

  • Various gas flows

  1. At the end of the process, “Process Over” will be printed over the Process Monitor screen and be blinking in different colors. Press any key to save the process data. This will also exit back to the Process for Engineer screen.

  1. A process may be interrupted and stopped by pressing the ESC key on the keyboard. This will turn off the lamps. If the “Turn Off Gases After Process” in the recipe is set to NO, then the gases that are on will stay on and flow at the current flow rate. If it is set to YES, then the gases will be shut off.

  1. To view the last run process data graphically, click on the Display Last Data button. This will display the process data on a screen very similar to the Process Monitor screen. To view process data from previous runs, select the process data to be viewed from the “Data ID” column, and then click on the Display Process Data button.

8. Editing running and reviewing a recipe

 

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  1. To edit a recipe, select it from the “Recipe File” list, open it by clicking on the recipe edit button and modify parameters as required before saving it. To create a new recipe, open an existing recipe and change its name before modifying the parameters and saving it. Leave the EXT field as RCP. Pyrometer recipe names must begin with “p_” and TC recipe names must begin with “t_”. Recipes not complying with this naming convention will be deleted at anytime by SNF staff.  

  1. Sensor type must be set to either TC or pyrometer as appropriate.

  1. Emissivity sets the  value for the emissivity to be used with the pyrometer. A standard silicon wafer has an emissivity of 77.04. The software treats emissivity as a factor that offsets the pyrometer temperature reading.

  1. The five variables - Gain, Sensitivity, Delay, Psum1 Average and Psum2 Average - are for fine tuning the temperature control performance.

    1. Gain: The value for the gain of the temperature PID control for the process steps RAMP and STEADY.

    2. Sensitivity: The value for the coefficient of the gain in the STEADY period of the recipe. This makes the gain for a STEADY step different from a RAMP step. The gain value for STEADY is GAIN x SENSITIVITY. If the SENSITIVITY value is 1.0, there is no difference between the gain for a RAMP and a STEADY.

    3. Delay: This is the value for the transient period from RAMP to STEADY. Normally the default value is 1.0.

    4. Psum1 and Psum2 check for average intensity and are set to 1.0 by default to disable the alarm.

  1. The turn off gas after process button toggles between Yes and No. Yes means that all of the gases will be turned off when the process ends. No means the last gas settings will remain on after the process ends. This is good if the last step purges the heating chamber and it is desirable to keep purging the chamber after the process ends.

  1. In the lower half of the screen, the recipe contains steps that describe the process cycle. Step Temp Func is the Process Function, which describes the type of process function for that step. It can be RAMP, INTN, STEADY, DELAY, or FINISH.

    1. Steady: During the Steady step, the lamp intensity is controlled to maintain the specified anneal temperature.  It then maintains that value until the specified time spent in the step has elapsed.

    2. Ramp: The Ramp step instructs the controller to increase the temperature at a constant rate until the specified temperature has been reached. The rate is calculated by dividing the difference between the temperature specified in the step and the temperature specified in the previous step by the time specified in the step. The process controller can not do two consecutive RAMP steps.

    3. Intn: The controller keeps the lamp power at a constant intensity during an Intensity step. The Intn step is used to heat  the wafer to a temperature where  thewafer is seen by the pyrometer.  The mininim reliable temperature for use of the pyrometer is 500ºC.

    4. Delay: The Delay step instructs the controller to turn the lamps off while setting and maintaining the setpoint of the other controlled parameters (i.e. Gases), until the specified time spent in the step has elapsed.

    5. Finish : This ends the recipe.

  1. Other columns

    1. Time: This is the amount of time, in seconds, to act on the current step

    2. Temp/Intn: This is the target temperature or intensity system strives for. If the step function is STEADY, then this is the set-point temperature that is to be maintained. If the step function is RAMP, then this is the ending temperature of the ramp. If the step function is INTN, then this is the percentage of the lamp power intensity. If the step function is DELAY, then this field has no effect and the lamps are turned off during this step.

    3. Steady Intn Factor: This is a coefficient used only during RAMP and STEADY steps. It is used at the beginning of the steps to correct the initial lamp power intensity. See the Technical Manual for fine tuning the system to understand how to use this parameter effectively.

    4. Gas: The various gas columns specify the flow rate of each gas for each step.

  1. When entering data values into the data entry area, the recipe editor checks for out-of-range entries. If a value is out-of-range, the editor will alert you and will advise you of the proper range. The recipe can be validated by clicking on the Recipe Validate button. All errors need to be corrected before the recipe can be used for processing. Click Save and Exit the Recipe Editor.

  1. Refer to Section 6.3 in the Technical Manual for information on optimizing the recipe and temperature profile.

9. Requesting for pyrometer mode

 

Requests for conversion to pyrometer mode must be made at least two days in advance by writing to the appropriate aw610 mailing list. A conversion will then be scheduled based on the number of requests and availability of super-users for the conversion and announced on the mailing list.

10. Guidelines for time-temperature

 
The system is not capable of doing long anneals over extended periods of time, especially at higher temperatures. The following chart should serve as a broad guideline in determining allowable anneal time for the required temperature (roughly log dependence). When in doubt, contact the staff before you run a new recipe. 
 

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