MRC Model 55 RIE, mrc (contaminated)
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Quick starts are a condensed version of the more detailed and verbose Operating Instructions. The user of the tool is responsible for having read and understood the Operating Instructions.
The following is a list of recipes used in the etcher by various labmembers. They are offered as a starting point for interested users. Users of the MRC are cautioned to establish etch rates for their specific samples, materials and patterns.
This folder contains results of qualification tests using various recipes.
We have a pirani gauge that can be connected to the mrc to give more precise chamber pressure readings.