Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl)
Inductively Coupled Plasma Etchers with Versaline Software - Metal, Oxide and Deep Silicon Etchers
The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on a flexible range of substrate types. It complements P5000 Metal Etcher as it can handle more materials and belongs to the "Contaminated" group of equipment. PT-MTL can be configured to etch either 4" or 6" wafers and the default configuration is 4".
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and deep glass/quartz etching.
The Versaline LL-DSE Deep Silicon Etcher was acquired in late 2011 for DRIE silicon etching on substrates containing non-MOS materials.
Procedure to create, edit and modify recipes for PT-MTL, PT-OX, PT-DSE and hdpcvd. In order to minimize recipe errors and better maintain equipment health, recipes need to go through an approval process before creation & use. Please consult responsible staff for approval.
The PlasmaTherm VersaLine systems rely on a wafer sensor in the load lock that makes processing transparent wafers particularly challenging. Here is a procedure to safely work around the sensor.