STS Deep RIE Etcher, stsetch (semi-clean)
This is a IPC (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.
Quick starts are very condensed versions of the more detailed and verbose Operating Instructions. Users of the etcher are responsible for having read and understood the Operating Instructions.
This folder contains SEMs of qual wafers. Most of the images have been taken at the 20um pillars on a resolution mask.
A. A. Ayón, R. Braff, C. C. Lin, H. H. Sawin, and M. A. Schmidt. Journal of The Electrochemical Society, 146 (1) 339-349 (1999)
Etches done with and without the aluminum wafer holder, showing the effect on the etch profiles and "grassing" (micromasking)
This folder contains studies of various parameters and machine conditions. Often these studies are started during the trouble shooting process.