STS HRM Deep RIE Etcher, stsetch2 (semi-clean)
This is a Multiplex Pro ASE HRM Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system with a 2-wafer loading carousel. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.
This response table can be used as a recipe optiminzation chart for labmembers wanting to change the parameters of standard recipes.
An example of high aspect ratio etch profile (thanks to Edwin Ng!)
Staff member Jim McVittie has complied a list to parameter changes to improve profiles for stsetch2.
This folder contains reports from studies, EE412 and interested Labmembers.
Crystalbond may be used in stsetch2 for through etching or the etching of delicate samples. It is an adhesive with good cooling properties and allows for the easy removal of samples from a carrier wafer.