Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Equipment / Metalization & Sputtering / Evaporation / IntlVac Nanochrome I Evaporator, intlvac_evap, Automatic

IntlVac Nanochrome I Evaporator, intlvac_evap, Automatic

This tool provides a combination of e-beam and thermal evaporation. The tool has a six-pocket hearth for e-beam evaporation and two boats for thermal evaporation. There is a separate crystal monitor for the e-beam evaporation and for the thermal evaporation sources. The e-beam controllers allow for automatic deposition (controlled ramps, pre-heat soaks, deposition rates and final thickness). A pattern generator controls the e-beam sweep patterns (e.g. in a circle or spiral). Oxygen and nitrogen are plumbed to the chamber for reactive deposition. There is also an ion beam source for pre-cleans and film modification during the deposition.

Picture and Location

 Intlvac_evap01

The tool is located at E56 on the Lab Map.

 

Process Capabilities

Cleanliness Standard

Clean and Semi-Clean only, no gold category processing is allowed.  If you have any questions regarding the use of the system, make sure to ask prior to loading your samples.

 

Performance of the Tool

What the Tool CAN do

  • Qualified sources are: Cr, Al, Ti and Pt
  • Sources provided by the SNF in future: Al, Co, Cr, Ge, Hf, Mo, Nb, Ni, Pd, Pt, Si, Ta, Ti, V, W and Zr.
  • All sources must be weighted before and after use and material usage charges may apply.

 

What the Tool CANNOT do

 

Process Monitoring

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

  • Process Staff: Mahnaz Mansourpour
  • Maintenance: Jim Haydon

 

Training to Become a Tool User

Contact Mahnaz Mansourpour for training.  Training is a two part training.  The first is an orientation to the system and the second is observation of your first runs.  Once you have successfully completed all aspects of the training, you will be given a personal log-in account on the system.

 

Operating Procedures

 

INTLVAC AUTOMATIC EVAPORATOR INSTRUCTION

Enable tool on Badger, intlvac_evap

Vent/Load chamber:

1)       On main screen, hit “login” and log In with your ID and password. 

2)      Make sure main screen is in auto mode (select “auto”).  On bottom of screen, hit “vent” to start venting. Whenever venting, stay by the machine, since the door swings open when it is done.

          It takes about 4 minutes +/-.

3)      Crystal check, On SQC-310, main menu ( hit twice), Sensor info  life should be above 85%.

          All Metals and material are to be measured before and after deposition.

4)      Change  your gloves

5)      Inspect the chamber

6)      Inspect the shutter using a mirror or a wafer.

7)      With clean gloves  Unload the dummy wafers and put in the box that has been designated for INTLVAC dummies.  Load your wafers,. The Planetary holds 12 four inch wafers and 2 six inch wafers. All wafer slots require some type of wafers.

 

Prior to loading sources, check correct material/metal position that is posted on the front of the bell jar. Recipes have been written with designated film/crucible slot. I like to keep up with the height of the sources for repeatable result.

8)      On MDC EV-CI Indexer, make sure left-most toggle in up position in manual mode, and toggle CW or CCW to go to every pocket that you plan to evaporate, and make sure  you have the right metal in the right pocket.

                 Make sure that the pockets are centered, if not this is huge issue, shut down the tool.

9)       This is the time to add pallets to your target if the height is low.

           change the Mylar film on the windows.

10)      Close door gently and close the top and bottom flaps. On the main screen, select “pump.”

11)     Within 10 seconds both arms will drop. If it does not something is wrong and you'll have to vent and try again. Notify maintenance if it continues to fail.

Program metals:

1)      Ensure pressure is below 5e-7.   Typically two hours. You may have to re-login if timer has timed out.

2)      If timer time out and you have not reached the base pressure, Log in again and hit pump again.

 

a)      Move two white switches on very bottom to the up position. This is already on

b)      If for any reason the power on main panel is not on, you need to ....  On second bank of switches above bottom white switches, turn on “main power” by turning key to “on” position, and then hitting the green “on” button.

c)       All 4 lights on  high voltage  should be green

     Intlvac_evap02

d)      All 4 lights on Emission Current unit should be green

      Intlvac_evap03

 All 8  lights should be green as above picture shows.

 

1)      On main screen, while in Auto, press Profile (top left corner) if the light is dim, open, DEP-Only-Pf1  ok

2)      Verify that the column status rotation and source 1 e-beam are lite; all others are off (not lite). For deposition only.

3)      On top left corner, press chamber to go back to Main Screen.

4)      If the system in idle, pump for one minute, this will activate the start profile.

5)      Press up Load (this saves whatever is on in the Profile-dep-only.

6)      Press Start Profile (you will hear the wafer holder rotate). Check the EV-CL that is in AUTO

7)      On the SQC-310 is the “Deposition Controller” to select desired recipe.

8)      Select the “next menu” button until you see the button for “auto/manual”.  It should be already set “auto/manual” if not press until the order is “auto/manual” is visible. 

a.      Select “next menu” until the menu contains “process menu,” and select it.

9)      Use the scroll bar to select the correct metal recipe and press edit.

10)  Edit only the initial rate (rate of deposition) and the final thickness (total thickness deposited).  (Due to delay in shutter, the final thickness is always slightly high >   10 to 50A thicker than expected) on the display.

11)  Select “to main” to go back to main menu.

12)  Press up load again

12)  Repeat steps 6-11 for every metal layer that you plan to evaporate.

13)      Repeat steps 6-11 for every metal layer that you plan to evaporate.


   

Evaporation:      

  1. In Auto mode, make sure that the MDC EV-CI toggle is in Auto position. Pump chamber for 1 minute ( to reset the system).
  2. Use scroll knob to choose correct metal, and press “Select” (SOC-310 deposition Controller).
  3. Upload profile, Start profile on Main screen
  4. Press the Sweep (RED to Green on Sweep Controller) and the Dc button to turn it to green.
  5. Press the button, (Green) start on the SQC-310. If the button is red, press it so that it resets itself and it will turn green so you press start again.
  6. Watching the SQC-310 screen assuring power, dep. rate, dev % , etc . are preforming.
    Correctly, and log information into the logbook.  Monitoring e-beam through the viewport to insuring the metal heats up, and that the beam is in the center. If not press “STOP” and contact super user/ staff. You need to stay next to the system till evaporation is done.
  7. After layer is done press Stop and repeat steps from page 1, step 7 to 12 and page 2, steps 1-5.

 

Dual recipe:

            Turn sweep and DC button  off

            Pump the system for 1 minute. Go to SQC-310 

             Start—Stop, hit next menu till you see RESET button, RESET it.

            Start from step 2 of the program Metals      

 

Unload

 

1)      When done processing all metal depositions, press Process Adv.  Button (Large Green button)

waits 10 minutes for sources to cool.

2)       After the cool down, press “Process Advance” button (Large Green button) in the center. This will start venting the chamber. (~`four minutes)

3)      Door will slightly open once vented

4)      With clean gloves remove wafers  Replace your wafers with clean dummies back in the slots.

         Measure Final weight of your sources

5)       Check the system and vacuum it if needed.  The hose for this system is yellow with a black  nozzle tip that has a semi clean tag on it ( should not be dropped on the floor). The hose is on the left side of the system.  Wipe the seal around the door off any particles using wipes and IPA.    

 

6)      Close door gently and close the top and bottom flaps. On the main screen, select “pump.”

7)       Stay with machine until cross-over is achieved.

8)      Log-off and disable, entering the beginning and final weight of metals used in badger.

 

 

Full Machine:

 Intlvac_evap05

 

Deposition Controller:

Intlvac_evap06

 

Main Screen in Auto Mode:

Intlvac_evap08

 

Sweep Controller:

Intlvac_evap09

Process Monitoring and Machine Qualification

 

Procedure
Use one resist wafer. Contact Mahnaz Mansourpour (mahnaz@stanford.edu) in advance of the qual to obtain the resist wafers, which will be placed in the corresponding wafer box at the INTLVAC tool bench. Note: For help identifying tool parts, reference the tool photos above.


Loading

            1.     Login to intlvac_evap. Do not forget ‘-SU’ after your username.

            2.     Vent Chamber (~ 5 minutes): press VENT on the main screen

                        a.     Check Crystal: Ensure crystal life is above 85%. Scroll through menus on deposition controller screen and press “Sensor Info.” If the crystal is below 85% life, see “Replacing Crystals” below for directions.
                        b.     Change gloves.

                        c.     Heat Wafer: place resist wafer on the hot plate in the litho room for 1-2min @ 100C

            3.     Inspect Chamber: once chamber has vented, door will open

                        a.     

Change window films. New Mylar films can be found in the drawers at the end of aisle (against the wall shared with the Litho room).

                        b.     Check for any particles left by previous depositions. Check under the shutter as well. Clean if need be.

            4.     Load Wafers

                        a.     Use outer ring wafer slots. Unload the dummy wafer into specified INTLVAC dummy wafer box. Load wafer using metal litho tweezers in the INTLVAC drawer.

            5.     Check Metal Materials

                        a.     

Verify which pocket the desired deposition crucible is in. Corresponding pocket numbers for each metal crucible are posted on the front of the chamber door.

                        b.     To the right of the deposition controller screen, toggle the MDC EV-CL Indexer to manual mode. Toggle the indexer until the desired metal crucible is selected.
                        c.     Refill the metal crucible if it is running low/ has a large crater in the center.  Metal pellets can be found at the large supply table to the left of INTLVAC. Do not overfill the crucible as this interferes with the indexer rotation. If the pockets are not centered, contact an INTLVAC staff member.
                        d.     Measure the initial crucible weight and record in blue logbook located on at the large supply table to the left of INTLVAC.
                        e.     Return the indexer to AUTO mode.

            6.     Pump Down Chamber (1.5-2 hours): close door and shut the two side levers, then press PUMP on main screen

                        a.     Ensure chamber pressure is below 5e-7.
                        b.     Login again if need be as system timer may logout user.


Recipe Preparation

            1.     Verify that the indexer is set to AUTO mode.

            2.     Press the “Profile” tab on the main screen. Check that column status rotation and e-beam are both set to ON (lit up).

            3.     Press dry-pump (1 min) to activate the start profile.

            4.     Upload the default recipe Profile-dep-only on the main screen, then press “Start Profile.”

            5.     Now load the actual deposition recipe on the deposition controller screen. Select “Next Menu” until you reach “Process Menu.” Then scroll via the dial button until the correct metal recipe is selected.

            6.     Qual Recipe

                        a.     Depending on the qual being run, select the corresponding recipe:

                                    Metal Type -- Thickness to be Deposited (at 1A/s rate)
                                    Titanium (Ti) -- 300A
                                    Platinum (Pt) -- 250-300A
                                    Chromium (Cr) -- 400A
                                    Aluminum (Al) -- 500A
                        b.     Press “Edit” to verify the recipe parameters (which may have been altered by prior users). Only alter a) the initial rate (dep rate), and b) the final thickness (total dep thickness).
            7.     Press Upload again on the main screen to load the now selected deposition recipe.
 

Evaporation

            1.     Press dry-pump (1 min) to prepare the system for evaporation.

            2.     Press “Start Profile” on the main screen.

            3.     Below the deposition controller screen, press SWEEP and DC button to set both to ON. Buttons should light up green.

            4.     Process Monitoring: stay with tool until process finishes

                        a.     View e-beam through window port. If the e-beam is not centered, press “STOP” and contact INTLVAC staff so that the tool does not damage itself.

                        b.     Keep an eye on dep rate. Record any abnormalities.

 

Unloading

            1.     Press “Process Advance”.
            2.     Wait for cool down process to end (~10 min).
            3.     Press “Process Advance”.
            4.     Wait for vent process to end (~5 min).
            5.     Change gloves.
            6.     Remove wafers and replace dummy wafers.
            7.     Remove metal crucible and measure final weight. Record in blue logbook.
            8.     Close chamber door, press “Pump” on main screen.
            9.     Stay with machine until cross-over is achieved (indicated on main screen), then log-off INTLVAC.

 

Measuring
To measure the deposition thickness, perform lift-off on the resist wafer then use Alphastep. Use the wbsolvent bench for lift-off.

            1.     Clean wafer beaker with acectone (or ipa). Rinse 3x.
            2.     Fill out blue chemical sheet and place under edge of beaker.
            3.     Place wafer in beaker.
            4.     Acetone soak (10min): fully cover wafer in acetone
            5.     Gently wipe wafer with litho swab (particles should loosen/fall off at this stage). Alternatively, gently disrupt the beaker to cause particles to loosen.
            6.     Rinse the wafer with IPA (or methanol).
            7.     Dry wafer using air gun.
            8.     Measure wafer with Alphastep (contact a qualified SUMO user if necessary for assistance).  Find a place that has been etched and measure across it. Make sure to LEVEL if the trace is not horizontal. Take readings for the Top, Flat, Center, Left, and Right positions of the wafers.
 
                        a.     Alphastep Recipe: 400 length, 20 speed, 13um depth range
                        b.   Report the average reading for each location (T, F, C, L, R) for the qual results, along with the initial qual parameters.
 

Recording
For all wafers, record results on the SUMO monitor logs and Badger.

 

Replacing Crystals

Replace the crystal if the crystal life is not above 85%. Crystal life may be checked by scrolling through the menus on  the deposition controller screen and pressing “Sensor Info.” Use clean gloves. All crystal supplies (tool, new crystal, etc.) can be found at the INTLVAC tool bench.

            1.     Unscrew the crystal chamber plate lid. Only loosen two screws, then rotate the plate so that the plate does not fall. Set the screws in a safe location.
            2.     Pull out the crystal holder.
            3.     Gently remove the crystal using the crystal tool. Press down on the crystal and rotate with tool to remove.
            4.     Dispose of the crystal in the specified canister on the large supply bench to the left of INTLVAC.
            5.     Carefully remove a new crystal from the crystal container.
            6.     Insert the new crystal, again using the tool to carefully press and rotate. Insert the crystal with the prong tabs right side up, as these are how the tool correctly inserts the crystal.
            7.     Place the crystal holder back into the chamber.
            8.     Rotate the plate lid back to its original position.
            9.     Put the screws back in place, ensuring that the plate lid is centered over the crystal holder as you tighten the screws.

            10.  Check that the crystal life is now above 85%.

Document Actions