Film Stress for SiOx and SiNx Films
Stress due to film measured with StressTest equipment (lithography area).
This experiment measured the stress due to SiO and SiN films of the PECVD-CCP on test wafers.
|Recipe||Date||Stress (MPa tensile)
** For the SiN 300-1 measurements, the stresstest equipment reported a problem and the data could not be retrieved.