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SiN 350-1 Film Characteristics and Qual results

Values of deposition rate, film thickness, refractive index, and uniformity for SiN recipes at 350C.

The following table provides values from wafers that were run on the ccp-dep with the SiN 350-1 recipe at position 2 and were measured on the Woollam. All wafers were loaded into both machines with the flat surface towards the user.


Table information

The first entry in the table is the factory (FAT) qualification measurement. It was run with: RF=100W, P=950mT, 5% SiH4in He=200sscm, NH3=6sscm, N2=400sscm, He=1000sscm, Temp(lower)=300C, Temp(higher)=70, Time=6min.  Subsequent entries have a 6 min dep time (unless noted) and the upper temp was changed to 60C.

All measurements on the Woollam ellipsometer, 9-pts, SiN PECVD program in the Staff directory.

The thickness and rate values are in nm and nm/min respectively.

The refractive index reported is the average at 633nm for each case.

The deposition rate was calculated according to the following formula for each case:

(average thickness)/(deposition time)

The % uniformity was calculated according to the following formula for each case:

((maximum thickness)-(minimum thickness))/(2*average thickness)

 

Date Dep. Rate
mn/min
Average
Thick.
 Max. Thick. Min. Thick. Stnd. Dev.
Refrac. Index
%Uniform.
Comments
06/19/12 14.2 453.1 (average)
 - -
- 2.02 2.85  
11/07/12
13.23
-
 377.04 349.26
7.93
138.79
3.89

11/21/12
14.6
510.0
 523.7 491.2
9.04
2.46
3.20
Wafer to wafer uniformity check by Renata Hanna.  Dep time 00:36:00.
Wafer #1
 11/21/12  13.9  499.0  511.4  483.7  8.38  2.50  2.78  Wafer #2
 11/21/12  13.1  473.0  482.0  468.9  4.02  2.08  1.38  Wafer #3
 11/21/12  13.2  474.6  482.9  466.7  4.79  2.08  1.74  Wafer #4
 11/27/12  13.6  204.0  211.6  199.1  3.717  2.05  3.04  Throttle valve unstuck, transfer arm homed- 15 min test
 12/3/12  14.8  89.0  922  850  2.292  1.99  4.01  Test after chamber dep thick
 12/3/12  14.9  89.1  930  852  2.709  2.00  4.38  After plasma clean/coat, no seasoning
 12/13/12  14.0  62.0  65.4  59.2  2.04  1.998  5.0  Wafer to wafer uniformity check courtesy of Ludwig  Galambos.   Dep time 00:04:25
Wafer #1
 12/13/12  13.7  60.3  64.1  57.7  1.33  1.997  5.3  Wafer #2
 12/13/12  13.7  60.3  64.1  57.7  2.11  1.997  5.3  Wafer #3
 12/13/12  14.7  64.9  67.9  67.9  2.13  1.992  4.4  Wafer #4
 1/8/13  13.5  80.1  82.8  78.6  1.46  2.01  2.6  Qual after winter annual shutdown.  Wafer #1
 1/8/13  13.6  81.8  8.6  79.0  2.36  2.01  4.0  Wafer #2
 1/8/13  13.8  82.9  8.7  79.9  2.4  2.01  4.3  Wafer #3
 1/8/13  13.6  81.3  85.5  78.0  2.5  2.01  4.6  Wafer #4
2/23/13
13.7
82.4
85.9 80.7
1.64
-
3.16
Wafer #54
 10/30/13  13.6  81.7  84.1  79.6  -  1.985  2.7  After transfer plate alignment.

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