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SiNx Qual results- HD PECVD

Recent quals results for SiNx thin films are posted here and on the lab management software system.

 

Thin Film Characteristics

Date
Wafer ID
Dep Rate
A/min
Refractive
Index
Standard
Dev
%Uniformity
Stress
MPa
 Comments
12 July 2013
1
96.8 2.137
134.6
2.83
-271.19 comp  
12 July 2013 2
97.29
2.120
123.6
2.72
-250.63 comp  
12 July 2013 3
97.36
2.112
118.7
2.66
-222.81 comp  
18 July 2013
7
96.91
2.134
127.5
2.52
-276.83 comp  
18 July 2013 8
97.44
2.116
118.8
2.40
-265.21 comp  
18 July 2013 9
96.82
2.121
152.1
3.21
-269.42 comp
 
 11 Sept 2013
 hdq1sept13  96.2  2.14  155.0  1.0  -291.0 comp
 
 11 Sept 2013
 hdq2sept13  96.3  2.13  160.0  1.19  -297.6 comp
 
 11 Sept 2013
 hdq3sept13  96.7  2.12  161.5  1.33  -308.2 comp
 

 

 

Wet Etch Characteristics

Date
Wafer ID
Etch Temp
HF 50:1
nm/min
BOE 6:1
nm/min
BOE 20:1
nm/min
 12 July 2013
 1,2,3  23C  all etched
>678
 52.30  24.41
 12 July 2013
 Tox1, 2, 3
  23C  93.65  118.62  44.42
 18 July 2013  4,5,6   23C
 1323.73  15.34  28.48
 18 July 2013
 Tox4,5,6   23C  94.96  138.92  48.78
 11 Sept 2013
HDQ1, 2, 3sept13
 23C -
 2.6  6.8
 11 Sept 2013
 Tox1, 2, 3
 23C  7.0  97.0  32.2

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